The insulation performance of reactive parylene films in implantable electronic devices

Biomaterials

Volumn 30, Issue 31, 2009, Pages 6158-6167

  Seymour, John P ^a   Elkasabi, Yaseen M ^a   Chen, Hsien Yeh ^a   Lahann, Joerg ^a   Kipke, Daryl R ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Adhesion; Electrochemistry; Electronic material; Micromachining; Neural prosthesis; Parylene

Indexed keywords

ADHESION MEASUREMENT; ADHESION TEST; APPROPRIATE MATERIALS; ELECTRICAL TESTING; ELECTRONIC DEVICE; ELECTRONIC MATERIAL; FUNCTIONALIZED; HIGH FREQUENCY PERFORMANCE; HIGH IMPEDANCE; INSULATION PERFORMANCE; INTER-DIGITATED ELECTRODES; LOW DIELECTRIC CONSTANTS; METAL ADHESION; METAL LAYER; MICROFABRICATED DEVICES; NEURAL PROSTHESIS; PARYLENE; PARYLENE C; PARYLENE FILM; PARYLENES; REACTIVE GROUP; WET ADHESION;

ALDEHYDES; BIOCOMPATIBILITY; COMPOSITE MICROMECHANICS; ELECTROCHEMISTRY; ELECTRON DEVICES; FUNCTIONAL GROUPS; METAL TESTING; MICROMACHINING; PROSTHETICS;

ADHESION;

ALDEHYDE DERIVATIVE; BIOMATERIAL; FUNCTIONAL GROUP; METAL; PARYLENE C; POLY(4 XYLYLENE); SODIUM CHLORIDE; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL REACTION; COVALENT BOND; ELECTRICITY; ELECTRODE; HEATING; IMPEDANCE; IMPLANT; MATERIAL COATING; MEDICAL INSTRUMENTATION; METAL BINDING; PRIORITY JOURNAL;

BIOCOMPATIBLE MATERIALS; ELECTROCHEMISTRY; MODELS, THEORETICAL; POLYMERS; XYLENES;

EID: 69649086628     PISSN: 01429612     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.biomaterials.2009.07.061     Document Type: Article

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