Reliability prediction modeling of area array CSPs

Electronic Packaging and Production

Volumn 37, Issue 8, 1997, Pages 91-96

  Clech, Jean Paul ^a   Fjelstad, Joseph ^b  

^a Electron Packaging Solutions Intl   (United States)

^b Tessera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 6944244843     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Lau, J., Solder Joint Reliability, Theory and Applications, Van Nostrand Reinhold, New York, N.Y., 1991.
2. Albrecht, H. J. Gamalski and G. Petzold, "Metallurgical, Interfacial and Constructive Aspects on the Reliability of BGA Solder Joints," Proceedings of Surface Mount International, pp. 327-343, 1995.
3. Darveaux, R., K. Banerji, A. Mawer and G. Dody, "Reliability of Plastic Ball Grid Array Assemblies," Ball Grid Array Technology, ed. J.H. Lau, McGraw-Hill, New York, N. Y., 1995.
4. Davreau, R., "How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life," Proceedings of the International Congress on Experimental Mechanics, pp. 41-42, 1996.
5. Mei, Z., "TSOP Solder Joint Reliability," Proceedings of the ECTC, pp. 1232-1238, 1996.
6. Clech, J-P., "Solder Reliability Solutions: From LCCCs to Area Array Assemblies," Proceedings of NEPCON West, pp. 1665-1680, 1996.
7. Clech, J-P., D.M. Noctor, J.C. Manock, G.W. Lynott and F.E. Bader, "Surface Mount Failure Statistics and Failure Free Time," Proceedings of the ECTC, pp. 487-497, 1994.
8. Clech, J-P., J.C. Manock, D.M. Noctor, F.E. Bader and J.A. Augis, "A Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology," IEEE Trans. on CHMT, pp. 949-960, December 1993.
9. U.S. Patent Nos. 5,148,265; 5,148,266; 5,258,330; 5,346,861; 5,347,159; 5,414,298; 5,489,749.