SCOPUS 정보 검색 플랫폼

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1315-1318

Numerical prediction of failure paths at a roughened metal/polymer interface

(4) Noijen, S P M a,b van der Sluis, O a,b Timmermans, P H M a Zhang, G Q b

a PHILIPS RESEARCH LABORATORIES (Netherlands)

b DELFT UNIVERSITY OF TECHNOLOGY (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE FAILURE; ALUMINUM INTERFACES; COHESIVE FAILURES; ELECTRONIC PACKAGING; FAILURE PATHS; FRACTURE MECHANICS MODEL; INTERFACE PROPERTY; INTERFACE ROUGHNESS; METAL POLYMER INTERFACES; NUMERICAL PREDICTIONS; POLYMER-METAL INTERFACES; SURFACE ROUGHNESS PARAMETERS;

ALUMINA; ELECTRONICS PACKAGING; FRACTURE MECHANICS; POLYMERS; STRENGTH OF MATERIALS; SURFACE ROUGHNESS;

FRACTURE;

EID: 69249232019 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/j.microrel.2009.06.019 Document Type: Article

Times cited : (14)

References (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.