Molecular simulation on the material/interfacial strength of the low-dielectric materials

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1483-1491

  Yuan, Cadmus A ^a   van der Sluis, Olaf ^a,c   van Silfhout, Richard B R ^c  

^a Kouchi)   (Netherlands)

^b Kouchi)   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTERFACIAL ENERGY; MATERIALS SCIENCE; MOLECULAR DYNAMICS; STRENGTH OF MATERIALS;

CRACK/DELAMINATION MECHANISM; EXPERIMENTAL VALIDATION; LOW-DIELECTRIC MATERIALS;

DIELECTRIC MATERIALS;

EID: 34548755072     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.052     Document Type: Article

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