Nanoparticle-induced enhancement in fracture toughness of highly loaded epoxy composites over a wide temperature range

Journal of Materials Science

Volumn 41, Issue 13, 2006, Pages 4239-4245

  Han, J T ^a   Cho, K ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; FRACTURE TOUGHNESS; MOLDING; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; SILICA; THERMAL EFFECTS;

CRACK DEFLECTION; EPOXY COMPOSITES; EPOXY MOLDING COMPOUND (EMC); SINGLE EDGE NOTCHED BENDING (SENB);

COMPOSITE MATERIALS;

EID: 33747058068     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-6219-2     Document Type: Conference Paper

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