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Volumn 54, Issue 25, 2009, Pages 6003-6009
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Electrothermal modelling for EIBJ nanogap fabrication
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Author keywords
Biosensor; Electromigration; MPTMS; Nanoelectronics; Nanogap
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Indexed keywords
A-THERMAL;
ADHESION MOLECULES;
APPLICATION FIELDS;
APPLIED BIAS VOLTAGE;
BREAK JUNCTIONS;
DIFFERENT GEOMETRY;
ELECTROTHERMAL MODELLING;
FEEDBACK ALGORITHMS;
HIGH YIELD;
LOW COSTS;
METAL WIRES;
MPTMS;
NANOGAP;
NANOGAP FABRICATION;
NANOGAPS;
NANOMETRICS;
NEW OPPORTUNITIES;
ROOM TEMPERATURE;
TECHNOLOGICAL PROCESS;
THERMAL BEHAVIOURS;
TRIMETHOXYSILANE;
CHROMIUM;
ELECTRIC POTENTIAL;
ELECTROMIGRATION;
FABRICATION;
MOLECULAR ELECTRONICS;
NANOELECTRONICS;
SIGNAL TRANSDUCTION;
TITANIUM;
WIRE;
BIOSENSORS;
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EID: 69249198144
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2009.02.070 Document Type: Article |
Times cited : (20)
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References (13)
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