Microstructural refinement within a cold-sprayed copper particle

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 40, Issue 9, 2009, Pages 2115-2123

  King, Peter C ^a   Zahiri, Saden H ^a   Jahedi, Mahnaz ^a  

^a CSIRO   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COLD SPRAY; COPPER PARTICLES; FIB/SEM; HIGH STRAIN RATES; LARGE STRAINS; MICRO PARTICLES; MICROSTRUCTURAL REFINEMENT; MICROTWINS; NANOSIZED GRAINS; NON-HOMOGENEOUS; SEVERE PLASTIC DEFORMATIONS; SINGLE-PARTICLE; SUBSTRATE INTERFACE; TEM;

COPPER; DEPOSITS; TRANSMISSION ELECTRON MICROSCOPY;

STRAIN RATE;

EID: 68949140807     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-9882-5     Document Type: Article

References (30)

1. A. Papyrin, V. Kosarev, S. Klinkov, A. Alhimov, and V. Fomin: Cold Spray Technol., Elsevier, Oxford, United Kingdom, 2007.
2. H. Assadi, F. Gartner, T. Stoltenhoff, and H. Kreye: Acta Mater., 2003, vol. 51, pp. 4379-94.
3. B. Crossland and J.D. Williams: Met. Mater., 1970, vol. 4, pp. 79-100.
4. C. Borchers, F.S.T. Gartner, and H. Kreye: J. Appl. Phys., 2004, vol. 96, pp. 4288-92.
5. C. Borchers, F. Gartner, T. Stoltenhoff, H. Assadi, and H. Kreye: J. Appl. Phys., 2003, vol. 93, pp. 10064-10070.
6. R.C. McCune, W.T. Donlon, O.O. Popoola, and E.L. Cartwright: J. Therm. Spray Technol., 2000, vol. 9, pp. 73-82.
7. K. Balani, A. Agarwal, S. Seal, and J. Karthikeyan: Scripta Mater., 2005, vol. 53, pp. 845-50.
8. A.C. Hall, D.J. Cook, R.A. Neiser, T.J. Roemer, and D.A. Hirschfeld: J. Therm. Spray Technol., 2006, vol. 15, pp. 233-38.
9. A. Hall, P. Yang, L. Brewer, T. Buchheit, and T. Roemer: Thermal Spray 2008: Crossing Borders, Maastricht, Netherlands, 2008, E. Lugscheider, ed., ASM INTERNATIONAL, Materials Park, OH.
10. H. Ni and A.T. Alpas: Mater. Sci. Eng. A, 2003, vol. 361, pp. 338-49.
11. J.Y. Huang, Y.K. Wu, and H.Q. Ye: Acta Mater., 1996, vol. 44, pp. 1211-21.
12. O. Johari and G. Thomas: Acta Metall., 1964, vol. 12, pp. 1153-59.
13. R.C. Dykhuizen and M.F. Smith: J. Therm. Spray Technol., 1998, vol. 7, pp. 205-12.
14. M.W. Phaneuf: Micron, 1999, vol. 30, pp. 277-88.
15. J. Li, T. Malis, and S. Dionne: Mater. Charact., 2006, vol. 57, pp. 64-70.
16. K.B. Yin, Y.D. Xia, C.Y. Chan, W.Q. Zhang, Q.J. Wang, X.N. Zhao, A.D. Li, Z.G. Liu, M.W. Bayes, and K.W. Yee: Scripta Mater., 2008, vol. 58, pp. 65-68.
17. T. Price, P. Shipway, D. McCartney, E. Calla, and D. Zhang: J. Therm. Spray Technol., 2007, vol. 16, pp. 566-70.
18. P.C. King, S.H. Zahiri, and M.H. Jahedi: Acta Mater., 2008, vol. 56, pp. 5617-26.
19. W.-Y. Li, H. Liao, C.-J. Li, G. Li, C. Coddet, and X. Wang: Appl. Surf. Sci., 2006, vol. 253, pp. 2852-62.
20. J.D. Anderson: ModerW Compressible Flow: with Historical Perspective, 3rd ed., McGraw-Hill, Boston, MA, 2003.
21. E. Irissou, J.-G. Legoux, C. Moreau, and A.N. Ryabinin: Thermal Spray 2008: Crossing Borders, Maastricht, Netherlands, E. Lugscheider, ed., ASM INTERNATIONAL, Materials Park, OH, 2008.
22. L.E. Murr, C.-S. Niou, S. Pappu, J.M. Rivas, and S.A. Quinones: Phys. Status Solidi A, 1995, vol. 149, pp. 253-74.
23. E. Hirsch and J. Plesek: Int. J. Impact Eng., 2006, vol. 32, pp. 1339-56.
24. C.X. Huang, K. Wang, S.D. Wu, Z.F. Zhang, G.Y. Li, and S.X. Li: Acta Mater., 2006, vol. 54, pp. 655-65.
25. P.C.J. Gallagher: Metall. Trans., 1970, vol. 1, pp. 2429-61.
26. M.A. Meyers, O. Vöhringer, and V.A. Lubarda: Acta Mater., 2001, vol. 49, pp. 4025-39.
27. P.R. Thornton and T.E. Mitchell: Philos. Mag., 1962, vol. 7, pp. 361-75.
28. F.J. Zerilli and R.W. Armstrong: J. Appl. Phys., 1987, vol. 61, pp. 1816-25.
29. K. Wang, N.R. Tao, G. Liu, J. Lu, and K. Lu: Acta Mater., 2006, vol. 54, pp. 5281-91.
30. R.Z. Valiev, R.K. Islamgaliev, and I.V. Alexandrov: Prog. Mater. Sci., 2000, vol. 45, pp. 103-89.