On-chip hot spot remediation with miniaturized thermoelectric coolers

Microgravity Science and Technology

Volumn 21, Issue SUPPL. 1, 2009, Pages

  Bar Cohen, Avram ^a   Wang, Peng ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electronic cooling; Hot spot cooling; Thermal management; Thermoelectric cooler

Indexed keywords

COOLING TECHNIQUE; ELECTRONIC COOLING; HIGH FLUX; HOT SPOT; HOT SPOT COOLING; IN-CHIP; NOVEL APPLICATIONS; ON CHIPS; SILICON-BASED; SWITCHING SPEED; THERMAL MANAGEMENT; THERMOELECTRIC COOLER; TRANSISTOR DENSITY;

COOLING; COOLING SYSTEMS; POLLUTION; REFRIGERATORS; TEMPERATURE CONTROL; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY;

THERMOELECTRIC EQUIPMENT;

EID: 68749092015     PISSN: 09380108     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12217-009-9162-4     Document Type: Article

References (21)

1. A Boukai Y Bunimovich J Tahir-Kheli J Yu W Goddard III JR Heath 2008 Silicon nanowires as efficient thermoelectric materials Nature 451 168 171
2. Chowdhury, I., Prasher, R., Lofgreen, K., Chrysler, G., Narasimhan, S., Mahajan, R., Koester, D., Alley, R., Venkatasubramanian, R.: On-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology, Published online: 25 January 2009. doi: 10.1038/nnano.2008.417
3. P Di Marco W Grassi 2002 Motivation and results of a long-term research on pool boiling heat transfer in low gravity Int. J. Therm. Sci. 41 567 585
4. AW Herwaarden PM Sarro 1986 Thermal sensors based on the Seebeck effect Sens. Actuators 10 321 346
5. A Hochbaum R Chen RD Delgado W Liang E Garnett M Najarian A Majumdar P Yang 2008 Enhanced thermoelectric performance of rough silicon nanowires Nature 451 163 167
6. OA Kabov EA Chinnov V Cheverda 2007 Two-phase flow in short rectangular mini-channel Microgravity Sci. Technol. 19 3-4 44 47
7. J Kim 2003 Review of reduced gravity boiling heat transfer: US research J. Jpn. Soc. Microgravity Appl. 20 4 264 271
8. Litvinovitch, V., Bar-Cohen, A.: Effect of thermal contact resistance on optimum min-contact TEC cooling of on-chip hot spots. In: Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'09), San Francisco, July 19-23, Paper No. 2009-89289 (2009).
9. Litvinovitch, V., Wang, P., Bar-Cohen, A.: Impact of integrated superlattice μ-TEC structure on hot spot remediation. In: Proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic System, Orlando, Florida (ITHERM'08), pp. 1231-1241 (2008)
10. A Shakouri 2006 Nano-scale thermal transport and microrefrigerators on a chip Proc. I.E.E.E. 94 1613 1638
11. EA Silk EL Golliher RP Selvam 2008 Spray cooling heat transfer: technology overview and assessment of future challenges for micro-gravity application Energy Convers. Manag. 49 453 468
12. TM Tritt 2006 Thermoelectric materials, phenomena, and applications: a bird's eye view MRS Bull. 31 3 188 194
13. P Wang A Bar-Cohen 2007 On-chip hot spot cooling using silicon-based thermoelectric microcooler J. Appl. Physi. 102 3 034503-1-11
14. Wang, P., Bar-Cohen, A.: Analysis and simplified thermal model of silicon microcooler for on-chip hot spot thermal management. In: Proceedings of Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'07), Vancouver, Canada, July 8-12, Paper No: IPACK2007-33940 (2007b)
15. Wang, P., Bar-Cohen, A., Yang, B., Zhang Y., Shakouri, A.: Thermoelectric microcooler for hot spot thermal management. In: Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'05), San Francisco, California, July 17-22, Paper No: IPACK2005-73244 (2005)
16. Wang, P., Bar-Cohen, A., Yang, B.: Impact of thermal contact resistance on hot spot cooling using mini-contact enhanced thermoelectric coolers. In: Proceedings of IMAPS Thermal Management 2006, Palo Alto, California, September 10-13, (CDROM) (2006a)
17. Wang, P., Bar-Cohen, A., Yang, B.: Multiple silicon-based thermoelectric microcoolers for hot spot thermal management. In: Proceedings of the 13th International Heat Transfer Conference (IHTC-13), Sydney, Austria, August 13-18, Paper No: CND-09 (2006b)
18. P Wang A Bar-Cohen B Yang 2006 Analytical modeling of silicon thermoelectric microcooler J. Appl. Physi. 100 1 14501-1-13 14501
19. P Wang A Bar-Cohen B Yang 2009 Mini-contact enhanced thermoelectric coolers for on-chip hot spot cooling Heat Transf. Eng. 30 9 736 743
20. B Yang P Wang A Bar-Cohen 2007 Mini-contact enhanced thermoelectric cooling of hot spot in high power devices IEEE Trans. Compon. Packag. Technol., Part A 30 432 438
21. Zhang, Y., Zeng, G., Shakouri, A., Wang, P., Bar-Cohen, A.: Experimental demonstration of microrefrigerator flip-chip bonded with IC chips for hot spot thermal management. In: Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'05), San Francisco, California, July 17-22, Paper No: IPACK2005-73466 (2005)