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Volumn 267, Issue 16, 2009, Pages 2575-2578
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Comparison of inter-diffusion coefficients for Ni/Cu thin films determined from classical heating analysis and linear temperature ramping analysis by means of profile reconstruction and a numerical solution of Fick's law
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Author keywords
Diffusion; Linear temperature ramping; Thin films
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Indexed keywords
ANNEALING PROCEDURES;
ANNEALING TEMPERATURES;
ANNEALING TIME;
CONSTANT TIME;
DIFFUSION COEFFICIENTS;
FICK'S LAW;
FICK'S SECOND LAW;
HEAT TRANSFER MECHANISM;
HEATING ANALYSIS;
INFORMATION MODELS;
INTER-DIFFUSION;
LINEAR TEMPERATURE;
LINEAR TEMPERATURE RAMPING;
NUMERICAL SOLUTION;
PROFILE RECONSTRUCTION;
ROOM TEMPERATURE;
SAMPLE TEMPERATURE;
DIFFUSION;
HEAT EXCHANGERS;
HEAT TRANSFER;
LAWS AND LEGISLATION;
THIN FILMS;
ANNEALING;
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EID: 68349157404
PISSN: 0168583X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.nimb.2009.05.047 Document Type: Article |
Times cited : (4)
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References (10)
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