Data envelopment analysis approaches for solving the multiresponse problem in the Taguchi method

Artificial Intelligence for Engineering Design, Analysis and Manufacturing: AIEDAM

Volumn 23, Issue 2, 2009, Pages 159-173

  Al Refaie, Abbas ^a   Wu, Tai Hsi ^b   Li, Ming Hsien ^c  

^a UNIVERSITY OF JORDAN   (Jordan)

^b NATIONAL TAIPEI UNIVERSITY   (Taiwan)

^c FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Data envelopment analysis; Multiresponse problem; Taguchi method

Indexed keywords

COMPUTATIONAL EFFORT; DECISION-MAKING UNITS; MANUFACTURING APPLICATIONS; MULTIRESPONSE PROBLEM; ORTHOGONAL ARRAY; RANKING APPROACH; TAGUCHI;

DATA ENVELOPMENT ANALYSIS; LINEAR PROGRAMMING; RESEARCH; TAGUCHI METHODS;

PRINCIPAL COMPONENT ANALYSIS;

EID: 68349139837     PISSN: 08900604     EISSN: 14691760     Source Type: Journal    
DOI: 10.1017/S0890060409000043     Document Type: Article

References (20)

1. Antony, J. (2000). Multi-response optimization in industrial experiments using Taguchi's quality loss function and principal component analysis. Quality and Reliability Engineering International 16, 3-8.
2. Baker, R.C., & Talluri, S. (1997). A closer look at the use of data envelopment analysis for technology selection. Computers and Industrial Engineering 28, 101-108.
3. Belavendram, N. (1995). Quality by Design -Taguchi Techniques for Industrial Experimentation. Upper Saddle River, NJ: Prentice Hall International.
4. Charnes, A., Cooper, W.W., Letwin, A.A., & Seiford, L.M. (1994). Data Envelopment Analysis. Dordrecht: Kluwer.
5. Charnes, A., Cooper, W.W., & Rhodes, E. (1978). Measuring the efficiency of decision making units. European Journal of Operational Research 2, 429-444.
6. Cooper, W.W., Seiford, L.M., & Tone, K. (2000). Data Envelopment Analysis. Boston: Kluwer.
7. Jeyapaul, R., Shahabudeen, P., & Krishnaiah, K. (2006). Simultaneous optimization of multi-response problems in the Taguchi method using genetic algorithm. International Journal of Advanced Manufacturing Technology 30, 870-878.
8. Li, M.-H., Al-Refaie, A., & Yang, C.Y. (2008). DMAIC approach to improve the capability of SMT solder printing process. IEEE Transactions on Electronics Packaging Manufacturing 31(2), 126-133.
9. Liao, H.C. (2005). Using N-D method to solve multi-response problem in Taguchi. Journal of Intelligent Manufacturing 16, 331-347.
10. Liao, H.C., & Chen, Y.K. (2002). Optimizing multi-response problem in the Taguchi method by DEA based ranking method. International Journal of Quality & Reliability Management 19(7), 825-837.
11. Phadke, M.S. (1989). Quality Engineering Using Robust Design. Englewood Cliffs, NJ: Prentice-Hall.
12. Pignatello, J.J. (1993). Strategies for robust multiresponse quality engineering. IIE Transactions 25, 5-15.
13. Reddy, P.B.S., Nishina, K., & Subash Babu, A. (1997). Unification of robust design and goal programming for multiresponse optimization - a case study. Quality and Reliability Engineering International 13, 371-383.
14. Su, C.T., & Tong, L.I. (1997). Multi-response robust design by principal component analysis. Total Quality Management 8(6), 409-416.
15. Taguchi, G. (1991). Taguchi Methods. Research and Development, Vol. 1. Dearborn, MI: American Suppliers Institute Press.
16. Tai, C.Y., Chen, T.S., & Wu, M.C. (1992). An enhanced Taguchi method for optimizing SMT processes. Journal of Electronics Manufacturing 2, 91-100.
17. Tong, L.I., Su, C.T., & Wang, C.H. (1997). The optimization of multi-response problems in the Taguchi method. International Journal of Quality and Reliability Management 14(4), 367-380.
18. Tsao, C.C., & Hocheng, H. (2002). Comparison of the tool life of tungsten carbides coated by multi-layer TiCN and TiAlCN for end mills using the Taguchi method. Journal of Material Processing Technology 123, 1-4.
19. Wong, Y.H.W., & Beasley, J.E. (1990). Restricting weight flexibility in DEA. The Journal of the Operational Research Society 41, 829-835.
20. Yang, L.J. (2001). Plasma surface hardening of ASSAB 760 steel specimens with Taguchi optimisation of the processing parameters. Journal of Material Processing Technology 113, 521-526.