Molded substrates for inkjet printed modules

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 293-301

  Miettinen, Jani ^a   Kaija, Kimmo ^a   Mäntysalo, Matti ^a   Mansikkamaki, Pauliina ^a   Kuchiki, Mikiharu ^b   Tsubouchi, Mikihiko ^b   Rönkkä, Risto ^c   Hashizume, Kenichi ^c   Kamigori, Akiko ^c  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b Kyoritsu Chemical and Co Ltd   (Japan)

^c NOKIA RESEARCH CENTER   (United States)

Author keywords

Dielectric ink; Inkjet (IJ); Nanoparticle ink; Printable electronics; System in package (SiP)

Indexed keywords

ADDITIVE PROCESSING; DIELECTRIC INK; DIRECT WRITING; DROP-ON-DEMAND PRINTING; ELECTRONICS MANUFACTURING; EMBEDDED COMPONENTS; ENCAPSULATION METHODS; HEATING CYCLES; HIGH TEMPERATURE; HIGHLY INTEGRATED; INK-JET PRINTING; INKJET (IJ); INKJETTING; MATERIAL CHARACTERIZATIONS; METALLIC NANOPARTICLES; MOLDING MATERIALS; MOLDING PROCESS; NON-PLANAR SURFACES; ORGANIC MATERIALS; PRINTABLE ELECTRONICS; PRINTED WIRING BOARDS; PROCESS CONDITION; PROCESS YIELD; SUBTRACTIVE METHOD; SURFACE CHARACTERISTICS; SYSTEM-IN-PACKAGE (SIP);

CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; CONDUCTIVE MATERIALS; DIELECTRIC MATERIALS; ELECTRONIC EQUIPMENT MANUFACTURE; INK; INTERNET PROTOCOLS; MECHANICAL PROPERTIES; MOLDING; NANOPARTICLES; PRINTED CIRCUIT BOARDS; PRINTING; SUBSTRATES; SYSTEMS ANALYSIS;

SURFACES;

EID: 68349126780     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2008314     Document Type: Article

References (16)

1. P. Buffat and J.-P. Borel, "Size effect on the melting temperature of gold particles," Phys. Rev. A, vol. 13, no. 6, pp. 2287-2298, 1976.
2. R. Rönkkä, S. Pienimaa, P. Mansikkamäki, and M. Mäntysalo, "Flexibility in inkjet and nano-material based electronics manufacturing business," in Proc. Eur. Microelectron. Packag. Conf. Oulu, Finland, Jun. 17-20, 2007, pp. 718-722.
3. R. A. Street, W. S. Wong, S. E. Ready, M. L. Chabinyc, A. C. Arias, S. Limb, A. Salleo, and R. Lujan, "Jet printing flexible displays," Mater. Today, vol. 9, no. 4, pp. 32-37, 2006.
4. S. Sanaur, A. Whalley, B. Alameddine, M. Carnes, and C. Nuckolls, "Jet-printed electrodes and semiconducting oligomers for elaboration of organic thin-film transistors," Organic Electron., vol. 7, no. 5, pp. 423-427, 2006.
5. T. Kaydanova and A. Miedaner, "Direct-write inkjet printing for fabrication of barium strontium titanate-based tunable circuits," Thin Solid Films, no. 515, pp. 3820-3824, 2007.
6. D. Redinger, S. Molesa, S. Yin, R. Farschi, and V. Subramanian, "An ink-jet-deposited passive component process for RFID," IEEE Trans. Electron Devices, vol. 51, no. 12, pp. 1978-1983, Dec. 2004.
7. W. Voit and W. Zapka, "Application of inkjet technology for the deposition of magnetic nanoparticles to form micron-scale structures," IEE Proc. Sci., Meas., Technol., vol. 150, no. 5, pp. 252-256, 2003.
8. V. Subramanian, J. Fréchet, P. Chang, D. Huang, J. Lee, S. Molesa, A. Murphy, D. Redinger, and S. Volkman, "Progress toward development of all-printed RFID tags: Materials, processes, and devices," Proc. IEEE, vol. 93, no. 7, pp. 1330-1338, Sep. 2005.
9. H. Saito and Y. Matsuba, "Liquid wiring technology by ink-jet printing using nanopaste," in Proc. IMAPS'06 39th Int. Symp. Electron., San Diego, CA, Nov. 11-15, 2006.
10. M. Mäntysalo, P. Mansikkamäki, J. Miettinen, K. Kaija, S. Pienimaa, R. Rönkkä, K. Hashizume, A. Kamigori, Y. Matsuba, K. Oyama, N. Terada, H. Saito, M. Kuchiki, and M. Tsubouchi, "Evaluation of inkjet technology for electronic packaging and system integration," in Proc. 57th Electron. Compon. Technol. Conf., Reno, NV, May 29-Jun 1 2007.
11. V. Pekkanen, M. Mäntysalo, J. Miettinen, and P. Mansikkamäki, "Novel packaging technology for combo memory package," in European Microelectronics and Packaging Conference, Oulu, Finland, June 17-20, 2007, pp. 89-94.
12. P. G. de Gennes, "Wetting: Statics and dynamics," Rev. Modern Phys. vol. 57, no. 3, pt. 1, pp. 827-863, 1985.
13. J. A. Lim, J. H. Cho, Y. Jang, J. T. Han, and K. Cho, "Precise control of surface wettability of mixed monolayers using a simple wiping method," Thin Solid Films, no. 515, pp. 2079-2084, 2006.
14. Z. Radivojevic, K. Andersson, K. Hashizume, M. Heino, M. Mäntysalo, P. Mansikkamäki, Y. Matsuba, and N. Terada, "Optimised curing of silver based ink jet printed traces," in Proc. Therminic'06, Nice, France, 2006, pp. 163-168.
15. J. Pekkanen, M. Heino, P. Mansikkamäki, M. Mäntysalo, and R. Rönkkä, "Laser sintering of Ag nano paste for printed electronics," in Nanotech Northern Eur.'07, Helsinki, p. 78.
16. K. Kaija, J. Miettinen, M. Mäntysalo, P. Mansikkamäki, M. Kuchiki, M. Tsubouchi, and R. Rönkkä, "Modeling the effect of assembly parameters on warpage and stresses of molded package for inkjet printing," in Eur. Microelectron. Packag. Conf., Oulu, Finland, Jun. 17-20, 2007.