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Volumn 32, Issue 2, 2009, Pages 293-301

Molded substrates for inkjet printed modules

Author keywords

Dielectric ink; Inkjet (IJ); Nanoparticle ink; Printable electronics; System in package (SiP)

Indexed keywords

ADDITIVE PROCESSING; DIELECTRIC INK; DIRECT WRITING; DROP-ON-DEMAND PRINTING; ELECTRONICS MANUFACTURING; EMBEDDED COMPONENTS; ENCAPSULATION METHODS; HEATING CYCLES; HIGH TEMPERATURE; HIGHLY INTEGRATED; INK-JET PRINTING; INKJET (IJ); INKJETTING; MATERIAL CHARACTERIZATIONS; METALLIC NANOPARTICLES; MOLDING MATERIALS; MOLDING PROCESS; NON-PLANAR SURFACES; ORGANIC MATERIALS; PRINTABLE ELECTRONICS; PRINTED WIRING BOARDS; PROCESS CONDITION; PROCESS YIELD; SUBTRACTIVE METHOD; SURFACE CHARACTERISTICS; SYSTEM-IN-PACKAGE (SIP);

EID: 68349126780     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2008314     Document Type: Article
Times cited : (17)

References (16)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.