Polymer nanocomposites for electronic packaging

Advancing Microelectronics

Volumn 36, Issue 3, 2009, Pages 26-31

  Das, Rabindra N ^a   Lauffer, John M ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISCRETE RESISTORS; ELECTRICAL PROPERTY; ELECTRONIC PACKAGING; EMBEDDED PASSIVES; EPOXY NANOCOMPOSITES; HIGH DENSITY INTERCONNECTS; HIGH FREQUENCY; HIGH-CAPACITANCE DENSITY; K-VALUES; LOW K DIELECTRICS; LOW LOSS; LOW RESISTIVITY; LOW-K MATERIALS; POLYMER NANOCOMPOSITE; PRESSURE COOKER TESTS; TEMPERATURE RANGE; TEST VEHICLE; VOLUME RESISTIVITY;

BRAZING; CAPACITANCE; CAPACITORS; CONDUCTING POLYMERS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; NANOCOMPOSITES; PARTICLE SIZE; POLYMERS; RANGE FINDING; RESISTORS; SILICA; THERMAL CYCLING; WELDING;

DIELECTRIC MATERIALS;

EID: 68149141799     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

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2. Lappas, A., Zorko, A., Wortham, E., Das, R. N., Giannelis, E. P., Cevc, P., and Arcon, D., "Low-Energy Magnetic Excitations and Morphology in Layered Hybrid Perovs kite-Poly (dime thylsiloxane) Nanocomposites," Chem. Mater., Vol. 17 (2005) pp. 1199-1207.
3. Scully, S. R., Lloyd, M.T., Herrera, R., Giannelis, E. P., Maliaras, G. G., "Dye-sensitized solar cells employing a highly conducting and mechanically robust nanocomposite gel-electrolyte," Synthetic Metals, Vol. 144, No. 3 (2004) pp. 291-296.
4. st International Symposium on Microelectronics, November 2008.
5. Egitto, F.D., Krasniak, S.R., Blackwell, K.J., and Rosser, S.G., 2005, "Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages," Proceedings Fifty-Fifth Electronic Components and Technology Conference, May 31 to June 3, 2005, Lake Buena Vista, FL (IEEE, Piscataway NJ, USA), (2005), pp. 1132-1138.
6. Das R. N., Egitto F. D., Markovich V. R., "Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections: New direction for high-density high-speed, organic microelectronics packaging," Circuit World, Vol. 34, No. 1 (2008) pp. 3-12.