Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications

Composites Part A: Applied Science and Manufacturing

Volumn 40, Issue 8, 2009, Pages 1179-1185

  Murali, K P ^a,b   Rajesh, S ^a   Prakash, Om ^b   Kulkarni, A R ^b   Ratheesh, R ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

Author keywords

A. Laminates; A. Polymer matrix composites; B. Electrical properties

Indexed keywords

A. LAMINATES; A. POLYMER-MATRIX COMPOSITES; B. ELECTRICAL PROPERTIES; CIRCUIT APPLICATION; COMPOSITE SUBSTRATE; COMPOSITE SYSTEMS; EFFECTIVE DIELECTRIC CONSTANTS; EXPERIMENTAL DATA; FILLER LOADING; FLEXIBLE COMPOSITES; FLEXIBLE LAMINATES; LINEAR COEFFICIENT OF THERMAL EXPANSION; MATRIX; MOISTURE ABSORPTION; NANOSIZE SILICA; PARTICULATE FILLERS; PREPARATION AND PROPERTIES; THEORETICAL MODELING; ULTIMATE TENSILE STRENGTH; WAVEGUIDE CAVITY; X-BAND FREQUENCIES;

CALENDERING; CERAMIC CAPACITORS; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC PROPERTIES; FILLERS; FUSED SILICA; HOT PRESSING; LAMINATES; MATRIX ALGEBRA; MICROWAVE CIRCUITS; MICROWAVE DEVICES; OXIDES; PERTURBATION TECHNIQUES; SCANNING ELECTRON MICROSCOPY; SILICA; SUBSTRATES; TENSILE STRENGTH; THERMAL EXPANSION;

POLYMER MATRIX COMPOSITES;

EID: 67651064338     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2009.05.007     Document Type: Article

References (25)

1. Daigle B. Printed circuit board material and design consideration for wireless application. IEEE Electronic components and technology conference. Orlando (FL, USA); 1996. p. 354-7.
2. Donald S.F., Andrew M.S., and Mark D.P. Manufacturing experience with high performance mixed dielectric circuit boards. IEEE Trans Adv Pack 22 2 (1999) 153-159
3. Sharma J, Choate M, Peters S. Laminate materials with low dielectric properties. In: IPC Printed Circuit Expo; 2002. p. S05-1-8.
4. Walpatia L.M., Ahern M.R., Chen P., Goldberg H., Hanley S., Pleban W.M., et al. Temperature-compensated thermoplastic high dielectric-constant microwave laminates. IEEE Trans Microw Theory Technol 47 8 (1999) 1577-1584
5. Laverghetta T.S. Microwave materials and fabrication techniques (1984), Artech House, Inc., USA
6. 3 microwave laminates. Polym Compos; in press, doi:10.1002/pc.20716.
7. Light D.N., and Wilcox J.R. Process considerations in the fabrication of fluoropolymer printed circuit boards. IEEE Trans Compon Pack Technol 18 1 (1995) 118-126
8. Horn III, Allen F. Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant. US Patent No. 5358775; 1994.
9. 2 composites. J Polym Res 10 (2003) 247-258
10. Chen Y.-C., Tsai C.-C., and Lee Y.-D. The effects of phenyltrimethoxysilane coupling agents on the properties of PTFE/silica composites. J Polym Res 11 (2004) 1-7
11. Huang S.-I., Chen T.-H., and Chen H. Study on the composites of two sized silica filled in PTFE. J Reinf Plast Compos 25 (2006) 1053-1058
12. 2 organic-inorganic hybrids via sol-gel process. J Polym Sci Polym Chem 42 (2004) 1789-1807
13. Wall A.L. Fluoropolymers (1972), John Wiley & Sons, Inc., USA
14. Murali KP, Rajesh S, Om Prakash, Kulkarni AR, Ratheesh R. Fabrication of alumina filled PTFE as flexible substrates for microwave circuit applications. In: Proceedings of ICRACM 2007, New Delhi, February 16-18; 2007. p. 1085-91.
15. Lei C., Wang X., Fang Q., Gao Y., Tu D., and Du Q. Space charge distribution and crystalline structure in quenched polytetrafluoroethylene. Eur Polym J 43 (2007) 4523-4529
16. Dube D.C., Lanagan M.T., Kim J.H., and Jang S.J. Dielectric measurements on substrate materials at microwave frequencies using cavity perturbation technique. J Appl Phys 63 7 (1988) 2466-2468
17. 2 and W fibers. J Am Ceram Soc 56 6 (1973) 345
18. Vo H.T., and Shi F.G. Towards model-based engineering of optoelectronic packaging materials: dielectric constant modeling. Microelectron J 33 (2002) 409-415
19. Todd M.G., and Shi F.G. Validation of a novel dielectric constant simulation model and the determination of its physical parameters. Microelectron J 33 (2002) 627-632
20. Hu T., Jutti J., Jantunen H., and Vilkman T. Dielectric properties of BST/polymer composites. J Eur Ceram Soc 27 (2007) 3997-4001
21. Goncharenko A.V., Lozovski V.Z., and Venger E.F. Lichtenecker's equation: applicability and limitations. Opt Commun 174 (2000) 19-32
22. George S., Varghese K.T., and Thomas S. Dielectric properties of isostatic polypropylene/nitrile rubber blends: effect of blend ratio, filler addition and dynamic vulcanization. J Appl Poly Sci 73 (1999) 255-270
23. Rao Y., Qu J., Marinis T., and Wong C.P. A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory. IEEE Trans Compon Pack Technol 23 4 (2000) 680-683
24. 3/PEEK composites for microwave substrate applications. Compos Sci Technol 68 (2008) 106-112
25. Sun J., Li J., Sun G., Zhang B., Zhang S., and Zhai H. Dielectric and infrared properties of silicon carbide nanopowders. Ceram Int 28 7 (2002) 741-745