Manufacturing experience with high performance mixed dielectric circuit boards

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 2, 1999, Pages 153-159

  Farquhar, Donald S ^a   Seman, Andrew M ^a   Poliks, Mark D ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC DEVICES; LAMINATED COMPOSITES; MICROWAVE INTEGRATED CIRCUITS; POLYTETRAFLUOROETHYLENES; PRINTED CIRCUIT DESIGN;

MIXED DIELECTRIC CIRCUIT BOARDS; STEPPED CAVITIES;

ELECTRONICS PACKAGING;

EID: 0033327633     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.763186     Document Type: Article

References (6)

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2. D. Troubough"Multilayer RF board constructions; Mixed dielectri materials and unbalanced constructions," in Proc. Wireless Workshop Tucson, AZ, 1995.
3. J. Johnson"Tetra-etchant for teflon board processing," Printed Circui Board Fabrication. San Francisco, CA: Miller Freeman, 1986.
4. W. E. MlynkoS. R. Cain, F. D. Egitto, and F. Emmi, "Plasm processing," Principles of Electronic Packaging. New York: McGraw Hill, 1989, ch. 14, pp. 424-453.
5. IPC-TM-650 Test Methods ManualBow and Twist. Lincolnwood, IL Inst. Interconnecting and Packaging Electronic Circuits, Nov. 1994, rev B, no. 2.4.22.
6. V. R. Markovich and F. S. Poch"Plated through-hole technology," i Principles of Electronic Packaging. New York: McGraw-Hill, 1989 ch. 17, pp. 519-538.