Nano-grained copper strip produced by accumulative roll bonding process

Materials Science and Engineering: A

Volumn 473, Issue 1-2, 2008, Pages 28-33

  Shaarbaf, Mahnoosh ^a   Toroghinejad, Mohammad Reza ^a  

^a ISFAHAN UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Accumulative roll bonding; Nano grained copper; Severe plastic deformation

Indexed keywords

CHARACTERIZATION; ELECTRON DIFFRACTION; FAILURE MODES; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); ROLL BONDING; STRAIN HARDENING; TENSILE STRENGTH; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

ACCUMULATIVE ROLL BONDING; ELECTRON BACKSCATTERED DIFFRACTION; NANO-GRAINED COPPER STRIP; SEVERE PLASTIC DEFORMATION;

COPPER;

CHARACTERIZATION; COPPER; ELECTRON DIFFRACTION; FAILURE MODES; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); ROLL BONDING; STRAIN HARDENING; TENSILE STRENGTH; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

EID: 37449012002     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.03.065     Document Type: Article

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