Profile-free copper foil for high-density packaging substrates and high-frequency applications

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 457-461

  Ogawa, Nobuyuki ^a   Onozeki, Hitoshi ^a   Moriike, Norio ^a   Tanabe, Takahiro ^a   Kumakura, Toshihisa ^a  

^a High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; RELIABILITY; STRENGTH OF MATERIALS; SUBSTRATES; SURFACE ROUGHNESS;

ADHESION STRENGTH; HIGH-DENSITY PACKAGING; SHORT-CIRCUIT FAULT; TRANSMISSION LOSS;

ELECTRONICS PACKAGING;

EID: 24644480250     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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5. rd IEMT/IMC Symposium, 1999
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