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Journal of Alloys and Compounds

Volumn 481, Issue 1-2, 2009, Pages 270-273

Novel morphology and solidification behavior of eutectic bismuth-tin (Bi-Sn) nanowires

(3) Chen, Shih Hsun a Chen, Chien Chon b Chao, Chuen Guang a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b NATIONAL UNITED UNIVERSITY (Taiwan)

Author keywords

AAO; Bi Sn nanowires; Eutectic; Solidification; Stoichiometry

Indexed keywords

AAO; ALLOY MELT; ANODIC ALUMINUM OXIDE; ATOMIC DEPOSITION; BI-SN NANOWIRES; COOLING RATES; FABRICATION PROCESS; HEAT FLOWS; HYDRAULIC FORCE; LAMELLAR MICROSTRUCTURE; LIQUID ALLOY; MELT SOLIDIFICATION; UNIFORM DIAMETER;

ALUMINA; BISMUTH; CHEMICAL ANALYSIS; COOLING; CRYSTALLIZATION; EUTECTICS; NANOWIRES; SOLIDIFICATION; STOICHIOMETRY; TIN; TIN ALLOYS;

ELECTRIC WIRE;

EID: 67649312032 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2009.03.107 Document Type: Article

Times cited : (13)

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