Effects of various metal seed layers on the surface morphology and structural composition of the electroplated copper layer

Metals and Materials International

Volumn 15, Issue 2, 2009, Pages 293-297

  Woo, Tae Gyu ^a   Park, Il Song ^a   Seol, Kyeong Won ^a  

^a Chonbuk National University   (South Korea)

Author keywords

Copper; Electrodeposition; Platinum; Sputtering; Surface morphology

Indexed keywords

ATOMIC FORCE MICROSCOPY; BINARY ALLOYS; COPPER; COPPER METALLOGRAPHY; CRYSTAL ATOMIC STRUCTURE; CRYSTAL ORIENTATION; ELECTRODEPOSITION; ELECTRODES; PALLADIUM ALLOYS; PLATINUM; PLATINUM ALLOYS; PLATINUM METALS; SCANNING ELECTRON MICROSCOPY; SPUTTERING; SURFACE MORPHOLOGY; SURFACE ROUGHNESS;

COPPER LAYER; ELECTRIC CHARACTERISTICS; ELECTRODEPOSITED COPPER FOILS; ELECTROPLATED COPPER; FOUR POINT PROBE; GROWTH ORIENTATIONS; LARGE PARTICLES; STRUCTURAL COMPOSITION;

MORPHOLOGY;

EID: 67649128359     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12540-009-0293-3     Document Type: Article

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