Application of beam mechanics to sensing the cure development of wood-phenolic joints by dynamic mechanical analysis

Thermochimica Acta

Volumn 465, Issue 1-2, 2007, Pages 18-24

  Wang, Jinwu ^a   Laborie, Marie Pierre G ^b   Wolcott, Michael P ^b  

^a WEYERHAEUSER COMPANY   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Dynamical mechanical analysis (DMA); Phenol formaldehyde resins; Shear modulus; Storage modulus

Indexed keywords

DELAMINATION; DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; FORMALDEHYDE; MOISTURE; OPTIMIZATION; PHENOLS; RESINS; RHEOMETERS; THERMAL EFFECTS;

CHEMICAL STATE; MECHANICAL ANALYSIS; SANDWICH BEAM; WOOD-PHENOLIC JOINTS;

COMPOSITE MATERIALS;

EID: 36148970091     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2007.08.003     Document Type: Article

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