Improving IC yield with protective ceramics

Semiconductor International

Volumn 23, Issue 6, 2000, Pages 217-218,-220

  Zhang, G ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; ANODIC OXIDATION; CERAMIC COATINGS; CHEMICAL VAPOR DEPOSITION; ELECTRIC INSULATING COATINGS; ION IMPLANTATION; OXIDES; PLASMA APPLICATIONS; POLYCRYSTALLINE MATERIALS; PROTECTIVE COATINGS; SPUTTERING; THERMOOXIDATION;

AMORPHOUS CERAMICS; DIRECT SPUTTERING; PLASMA OXIDATION; REACTIVE SPUTTERING;

INTEGRATED CIRCUITS;

EID: 6744268054     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. DiMaria et al, "Reliability Projection for Ultra-Thin Oxides at Low Voltage," Technical Digest of 1998 International Electron Device Meeting, pp. 167-70, Dec. 1998.
2. Zhang, "Applications of Protective Ceramics," U.S Patent 5,838,530, Nov. 17, 1998. The protective ceramics disclosed herein are a preferred embodiment of the above patent. It cannot be construed as a limitation to the scope of said patent. More information on the protective ceramics is available at http://sites.netscape.net/zhangpatents.
3. Shackelford, Introduction of Materials Science for Engineers, 2nd Edition, pp.609-610.
4. 2 from High Resolution Transmission Electron Microscopy," Journal of Electrochemical Society, Vol. 127, No, 12, pp. 2722-2728, Dec. 1980.
5. Masui et al, "Plasma Oxidation of Cu, Ti and Ni and Photoelectrochemical Properties of the Oxide Layers Formed," Materials Chemistry and Physics, Vol. 43, No. 3, pp 283-6, 1996.
6. 3 Insulating Layers," Thin Solid Films, Vol. 75, pp. 177-180, 1981.
7. King et al, "Sub-5nm Multiple-Thickness Gate Oxide Technology Using Oxygen Implantation," Technical Digest of 1998 International Electron Device Meeting, pp. 585-588, Dec. 1998.
8. Zhang et al, "Metal-to-Metal Antifuses with Very Thin Silicon Dioxide Films," IEEE Electron Device Letters, Vol. 15, No. 8, pp. 310-2, Aug. 1994.