Hardness variation and annealing behavior of a Cr-Ni multilayer electroplated in a trivalent chromium-based bath

Surface and Coatings Technology

Volumn 203, Issue 20-21, 2009, Pages 3320-3324

  Huang, Ching An ^a   Chen, Chao Yu ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Annealing; Cr Ni multilayer; Hardening mechanism; Hardness; Microstructure

Indexed keywords

ALTERNATING LAYERS; ANNEALING BEHAVIOR; BRASS SUBSTRATES; CR-NI MULTILAYER; CRYSTALLINE GRAINS; DIAMOND MEMBRANES; HARDENING MECHANISM; HARDNESS VARIATION; HIGH AFFINITY; NANOCRYSTALLINE; NANOSIZED GRAINS; PLATING BATH; TRIVALENT CHROMIUM;

ANNEALING; BRASS; CHROMIUM COMPOUNDS; CRYSTALLINE MATERIALS; ELECTROPLATING; HARDENING; HARDNESS; MICROSTRUCTURE; MULTILAYERS; NICKEL; ZINC;

CHROMIUM;

EID: 67349277658     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.04.011     Document Type: Article

References (21)

1. Marlot A., Kern P., and Landolt D. Electrochim. Acta 48 (2002) 29
2. Alper M., Aplin P.S., Attenborough K., Dingley D.J., Hart R., Lane S.J., Lashmore D.S., and Schwarzacher W. J. Magn. Magn. Mater. 126 (1993) 8
3. Switzer J., Shane M.J., and Phillips R.J. Science 247 (1990) 444
4. Kok Y.N., Hovsepian P.Eh., Luo Q., Lewis D.B., Wen J.G., and Petrov I. Thin Solid Films 475 (2005) 219
5. Shoujun W., Cheng L., Zhang L., and Yongdong X. Surf. Coat. Technol. 200 (2006) 4489
6. Nasi L., Bocchi C., Catellani A., Germini F., Morrod J.K., Prior K.A., and Calestani G. Appl. Phys. Lett. 91 (2007) 111908
7. Bonhote Ch., and Landolt D. Electrochim. Acta 42 (1997) 2407
8. Panagopoulos C.N., Papachristos V.D., and Christoffersen L.W. Thin Solid Films 366 (2000) 155
9. Leistner K., Fahler S., Schlorb H., and Schultz L. Electrochem. Commun. 8 (2006) 916
10. Dulal S.M.S.I., Charles E.A., and Roy S. Electrochim. Acta 49 (2004) 2041
11. Huang C.A., Chen C.Y., Hsu C.C., and Lin C.S. Scr. Mater. 57 (2007) 61
12. Papachristos V.D., Panagopoulos C.N., Wahlstrom U., Christoffersen L.W., and Leisner P. Mater. Sci. Eng. A 279 (2000) 217
13. Grabchikov S.S., Sosnovskaya L.B., and Yanushkevich K.I. J. Magn. Magn. Mater. 308 (2007) 101
14. Kaneko Y., Sakakibara H., and Hashimoto S. J. Mater. Sci. 43 (2008) 3931
15. C.A. Huang, C. C. Hsu, U.W. Lieu, US Patent 20080169199A1.
16. Klaar H.-J., and Huang C.-A. Prakt. Metallogr. 31 (1994) 290
17. Zeng Z., Wang L., Liang A., and Zhang J. Electrochim. Acta 52 (2006) 1366
18. Kwon S.C., Kim M., Park S.U., Kim D.Y., Kim D., Nam K.S., and Choi Y. Surf. Coat. Technol. 183 (2004) 151
19. Huang C.A., Chuang C.H., and Lieu U.W. The 4th International Conf. on Technol. Adv. of Thin Films & Surf. Coatings, 13-16 July (2008) Singapore
20. Surviliene S., Nivinskiene O., Cesuniene A., and Selskis A. J. Appl. Electrochem. 36 (2006) 649
21. Mcdougall J., El-Sharif M., and Ma S. J. Appl. Electrochem. 28 (1998) 929