Effect of annealing on the structure and hardness of Ni-P-W multilayered alloy coatings produced by pulse plating

Materials Science and Engineering: A

Volumn 279, Issue 1-2, 2000, Pages 217-230

  Papachristos, V D ^a   Panagopoulos, C N ^a   Wahlstrom, U ^b   Christoffersen, L W ^c   Leisner, P ^b  

^a NATIONAL TECHNICAL UNIVERSITY OF ATHENS   (Greece)

^b ACREO AB   (Sweden)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Annealing; Coatings; Hardness; Multilayer; Ni P W

Indexed keywords

ANNEALING; COPPER; DIFFERENTIAL THERMAL ANALYSIS; ELECTRON DIFFRACTION; HARDNESS; HIGH TEMPERATURE OPERATIONS; METAL FOIL; MULTILAYERS; NICKEL ALLOYS; PLATING; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COPPER FOILS; PULSE PLATING; ROTATING CYLINDER ELECTRODE; SELECTED AREA ELECTRON DIFFRACTION;

COATINGS;

HARDNESS; METALLIC COATING; MICROSTRUCTURE; NICKEL ALLOY;

EID: 0034728410     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00583-3     Document Type: Article

References (26)

1. Gonzalez-Hernandez J., Chao B.S., Pawlik D.A., Allred D.D., Wang Q. J. Vac. Sci. Technol. A. 10:1992;145.
2. Oshino T., Murakami K., Nakamura H., Ohtani M., Nagata H. Jpn. J. Appl. Phys. 33:1994;280.
3. Chao S.S., Pawlik D.A., Gonzalez-Hernandez J., Wang Q., Allred D.D. Solid State Commun. 79:1991;205.
4. Brunel M., Enzo S., Jergel M., Luby S., Majkova E., Vavra I. J. Mater. Res. 8:1993;2600.
5. Yamamoto K., Nakayama T., Satoh H., Konno T.J., Sinclair R. J. Magn. Magn. Mater. 126:1993;128.
6. Blanpain B., Allen L.H. Thin Solid Films. 248:1994;257.
7. Matsui T., Morii K., Nakayama Y. Scripta Metall. 24:1990;1149.
8. Baumann J.R., Liebemann E.K., Simon M., Bucher E. Phys. Rev. B. 45:1992;3778.
9. Rodmacq B., Hillairet J., Chamberod A. Solid State Commun. 76:1990;575.
10. Yuansheng W., Simon J.P. J. Mater. Sci. 27:1992;6755.
11. Yamani H., Maeno Y., Kobayashi M. J. Magn. Magn. Mater. 126:1993;320.
12. Xiao J.Q., Lin K., Chien C.L., Schelp L.F., Schmidt J.E. J. Appl. Phys. 76:1994;6081.
13. Fedosyuk V.M., Riveiro J.M. J. Non Cryst. Solids. 143:1992;153.
14. Krawietz R., Wehner B., Kallis N., Dietsch R., Mai H. Phys. Status Solidi (a). 145:1994;557.
15. Papachristos V.D., Panagopoulos C.N., Leisner P., Olsen M.B., Wahlstrom U. Surf. Coat. Technol. 105:1998;224.
16. H.E. Boyer (Ed.), Hardness Testing, ASM International, Metals Park, OH, 1987.
17. C.N. Panagopoulos, V.D. Papachristos, U. Wahlstrom, P. Leisner, L.W. Christoffersen, Scripta Metall. Mater. (submitted).
18. Koiwa I., Usuda M., Osaka T. J. Electrochem. Soc. 135:1988;1222.
19. H. Sawai, T. Kanamori, S. Shibata, K. Nihei, T. Osaka, I. Koiwa, M. Nishikawa, Proc. 11th Int. Cong. Met. Finish. Israel (1984) pp. 323.
20. Sui M.L., Lu K., He Y.Z. Philos. Mag. B. 63:1991;993.
21. Lu K., Wang J.T. J. Crystal Growth. 94:1989;448.
22. Nold E., Lamparter P., Olbrich H., Rainer-Harbach A., Steeb S. Z. Naturf. a. 36:1981;1032.
23. Lamparter P., Sperl W., Steeb S., Bletry J. Z. Naturf. a. 37:1982;1223.
24. Masui K., Maruno S., Yamada T. Jpn. J. Inst. Met. 41:1977;1130.
25. Koiwa I., Osaka T., Sawai H. J. Electrochem. Soc. 34:1983;600.
26. Ross C.A., Goldman L.M., Spaepen F. J. Electrochem. Soc. 140:1993;91.