Smart disassembly

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2004, Pages 166-167

  Hosoda, Naoe ^a   Halada, Kohmei ^a   Suga, Tadatomo ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Aluminium; Component; Disassembly; Gallium; Interface; LSI; Remove; Room temperature; Sapphire; Separtion; Solder

Indexed keywords

DISASSEMBLY; INTERFACE; LSI; ROOM TEMPERATURE; SOLDER;

ALUMINUM; BRITTLENESS; GALLIUM; INTERFACES (MATERIALS); LIQUID METALS; LSI CIRCUITS; MELTING; SAPPHIRE; SURFACE ROUGHNESS; THERMAL EFFECTS; WASTE DISPOSAL; WELDING;

SEPARATION;

EID: 4444327021     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. W.L.Tssai, Y.Hwu, C.H.Chen, L.W.Chang, J.H.Je, H.M.Lin, G.Margaritondo, "Grain boundary imaging, gallium diffusion and the fracture behavior of Al-Zn_alloy- An insitu study", Nuclear Instruments and Methods in Physics Research B vol.199 (2003)pp. 457-463, 2003
2. T.Akatsu, N.Hosoda, T.Suga and M.Ruehle, "Atomic structure of Al/Al interface formed by surface activated bonding", J. Mater. Sci. vol34, pp4133-4139, 1999
3. N.Hosoda, T.Akatsu, J.Chu and T.Suga, "The effect of the surface roughness on room temperature bonding of metals to ceramics", Advances in Science and Technology, pp1091-1096, 1998