Thermal analysis on the degradation of poly-silicon TFTs under AC stress

Materials Chemistry and Physics

Volumn 116, Issue 2-3, 2009, Pages 344-347

  Weng, C F ^a   Chang, T C ^a,b   Tai, Y H ^c   Huang, S T ^a   Wu, K T ^d   Chen, C W ^c   Kuo, W C ^a   Young, T F ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b Center for Nanoscience and Nanotechnology   (Taiwan)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^d NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

AC; Dymanic stress; LTPS; Poly Si; TFT

Indexed keywords

AC; DYMANIC STRESS; LTPS; POLY-SI; TFT;

POLYSILICON; THERMOANALYSIS; THIN FILM TRANSISTORS;

DEGRADATION;

EID: 67349252444     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2009.03.035     Document Type: Article

References (12)

1. Furuta M., Maegawa S., Sano H., Yoshioka T., Uraoka Y., Tsutsu H., Kobayashi I., Kawamura T., and Miyata Y. Euro Display Tech. Dig. 96 (16th Int. Display Res. Conf.). Birmingham, England (1996) 547
2. Nakajima Y., Kida Y., Murase M., Toyoshima Y., and Maki Y. SID Tech. Dig. (2004) 864-867
3. Wu I.W., Jackson W.B., Huang T.Y., Lewis A.G., and Chiang A. IEEE Electron Device Lett. 11 (1990) 167
4. Kato N., Yamada T., Yamada S., Nakamura T., and Hamano T. IEDM Tech. Dig. (1992) 677-680
5. Uraoka Y., Morita Y., Yano H., Hatayama T., and Fuyuku T. Jpn. J. Appl. Phys. 41 (2002) 5894
6. Toyota Y., and Shiba T. IEEE Trans. Elec. Devices 51 (2004) 927
7. Hack M., Lewis A.G., and Wu I.W. IEEE Trans. Elec. Devices 40 (1993) 890
8. Stewart M., Howell R.S., Pires L., and Hatalis M.K. IEEE Trans. Elec. Devices 48 (2001) 845
9. Zan H.W., Chang T.C., Shih P.S., Peng D.Z., Kuo P.Y., Huang T.Y., Chang C.Y., and Liu P.T. IEEE Electron Device Lett. 24 (2003) 509
10. Chen C.W., Chang T.C., Liu P.T., Lu H.Y., Tsai T.M., Weng C.F., Hu C.W., and Tseng T.Y. Electrochem. Solid-State Lett. 8 9 (2005) H69-H71
11. Fortunato G., Pecora A., Tallarida G., Mariucci L., Reita C., and Migliorato P. IEEE Trans. Elec. Devices 41 3 (1994) 340-346
12. Choi J.S., and Neudeck G.W. IEEE Trans. Elec. Devices 39 11 (1992) 2515-2522