Alumina composite suspension preparation for softlithography microfabrication

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 929-932

  Hassanin, H ^a   Jiang, K ^a  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

Alumina; Composites; Microfabrication; Softlithography

Indexed keywords

ALUMINA COMPOSITES; ALUMINA SUSPENSIONS; COATING RESINS; COMPOSITES; CURING CONDITIONS; MICRO-COMPONENTS; MOULD FILLINGS; OPTIMAL PARAMETERS; ORGANIC BINDERS; POLY[VINYL PYRROLIDONE]; PREPARATION PROCESS; SOFTLITHOGRAPHY; SOLID LOADINGS;

ACETONITRILE; ALUMINA; BINDERS; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; MOLDS; RESINS; SILICON CARBIDE;

SUSPENSIONS (FLUIDS);

EID: 67349095288     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.067     Document Type: Article

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