Chemical bond formation during laser bonding of Teflon ® FEP and titanium

Applied Surface Science

Volumn 255, Issue 15, 2009, Pages 7078-7083

  Georgiev, Grigor L ^a,b   Baird, Ronald J ^b   McCullen, Erik F ^b   Newaz, Golam ^b   Auner, Gregory ^b   Patwa, Rahul ^c   Herfurth, Hans ^c  

^a Wayne State University   (United States)

^b WAYNE STATE UNIVERSITY   (United States)

^c Fraunhofer Center for Laser Technology   (United States)

Author keywords

AES; EDS; Laser fabrication; Teflon FEP Ti interfaces; XPS

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; BONDING; CHEMICAL RESISTANT MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; ETHYLENE; HEAT AFFECTED ZONE; LASER CHEMISTRY; PACKAGING MATERIALS; POLYMERIC IMPLANTS; POLYTETRAFLUOROETHYLENES; SCANNING ELECTRON MICROSCOPY; TITANIUM; TITANIUM COMPOUNDS; X RAY PHOTOELECTRON SPECTROSCOPY;

AUGER ELECTRON SPECTROSCOPIES (AES); BOND FORMATION; CHEMICAL SOLVENTS; FLUORINATED ETHYLENE PROPYLENE; IMPLANTABLE DEVICES; INTERFACIAL REGION; LASER FABRICATION; MOISTURE UPTAKE;

CHEMICAL BONDS;

EID: 67349091453     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.03.046     Document Type: Article

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