Preparation and insulation property studies of thermoplastic PMMA-silica nanocomposite foams

Polymer Composites

Volumn 30, Issue 6, 2009, Pages 715-722

  Yeh, J M ^a   Chang, K C ^a   Peng, C W ^a   Chand, B G ^a   Chiou, S C ^a   Huang, H H ^a   Lin, C Y ^a   Yang, J C ^b   Lin, H R ^c   Chen, C L ^d  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^d INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BATCH PROCESS; CELL STRUCTURE; COMPARATIVE STUDIES; CONVENTIONAL ACIDS; DIELECTRIC CONSTANTS; FOAMING AGENT; FOURIER TRANSFORM INFRARED; IN-SITU; INSULATION PROPERTY; LCR METERS; NMR SPECTROSCOPY; NUCLEATION EFFICIENCY; PMMA MATRICES; PROPYL METHACRYLATE; SEM; SILICA NANOCOMPOSITES; SILICA PARTICLES; SOL-GEL REACTION; TEM; TETRAETHYL ORTHOSILICATE; THERMAL GRAVIMETRIC ANALYSIS; THERMAL STABILITY; THERMAL TRANSPORT; TRANSIENT PLANE SOURCE TECHNIQUES; VINYL-MODIFIED SILICA;

BATCH DATA PROCESSING; CERAMIC CAPACITORS; CHROMATOGRAPHIC ANALYSIS; DIELECTRIC LOSSES; DISPERSIONS; FOAMS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GELATION; GELS; GRAVIMETRIC ANALYSIS; NANOCOMPOSITES; NUCLEAR MAGNETIC RESONANCE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; RAPID SOLIDIFICATION; REINFORCED PLASTICS; SCANNING ELECTRON MICROSCOPY; SILICA; THERMAL CONDUCTIVITY; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

THERMAL INSULATION;

EID: 67049172205     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20601     Document Type: Article

References (36)

1. D. Klempner and K.C. Frisch, Handbook of Polymeric Foams and Foam Technology, New York, Oxford University Press (1991).
2. V. Kumar, M. VanderWell, J. Weller, and K.A. Seeler, J. Eng. Mater. Technol., 116, 439 (1994).
3. D.I. Collias, D.G. Baird, and R.J.M. Borggreve, Polymer, 35, 3978 (1994).
4. B. Xiang, R. Guan, Q. Fang, Z. Xiao, and Y. Jiang, J. Appl. Polym. Sci., 99, 1760 (2006).
5. C.D. Han, Y.W. Kim, and K.D. Malhorta, J. Appl. Polym. Sci., 20, 1583 (1976).
6. H.H. Yang and C.D. Han, J. Appl. Polym. Sci., 29, 4465 (1984).
7. J.S. Colton and N.P. Suh, Polym. Eng. Sci., 27, 485 (1987).
8. M. Okamoto, P.H. Nam, P. Maiti, T. Kotata, T. Nakayama, M. Takada, M. Ohshima, A. Usuki, N. Hasegawa, and H. Okamoto, Nano Lett., 1, 503 (2001).
9. Y. Fujimoto, S.S. Ray, M. Okamoto, A. Ogami, K. Yamada, and K. Ueda, Macromol. Rapid Commun., 24, 457 (2003).
10. M. Mitsunaga, Y. Ito, S.S. Ray, M. Okamoto, and K. Hironaka, Macromol. Mater. Eng., 288, 543 (2003).
11. C. Zeng, X. Han, L.J. Lee, K.W. Koelling, and D.L. Tomasko, Adv. Mater., 15, 1743 (2003).
12. J. Shen, C. Zeng, and L.J. Lee, Polymer, 46, 5218 (2005).
13. S. Siripurapu, J.M. DeSimone, S.A. Khan, and R.J. Spontak, Macromolecules, 38, 2271 (2005).
14. W. Zhai, J. Yu, L. Wu, W. Ma, and J. He, Polymer, 47, 7580 (2006).
15. Y.Y. Yu, C.Y. Chen, and W.C. Chen, Polymer, 44, 593 (2003).
16. A.A. Vassiliou, G.Z. Papageorgiou, D.S. Achilias, and D.N. Bikiaris, Macromol. Chem. Phys., 208, 364 (2007).
17. D. Bikiaris, V. Karavelidis, and G. Karayannidis, Macromol. Rapid Commun., 27, 1199 (2006).
18. S. Jain, H. Goossens, F. Picchioni, P. Magusin, B. Mezari, and M. van Duin, Polymer, 46, 6666 (2005).
19. S.M. Sze, Physics of Semiconductor Devices, Wiley, New York (1981).
20. M.S. Cho, Y.H. Cho, H.J. Choi, and M.S. Jhon, Langmuir, 19, 5875 (2003).
21. Y.H. Zhang, S.G. Lu, Y.Q. Li, Z.M. Dang, J.H. Xin, S.Y. Fu, G.T. Li, R.R. Guo, and L.F. Li, Adv. Mater., 17, 1056 (2005).
22. B. Krause, G.H. Koops, N.F.A. VanderVegt, M. Wessling, M. Wiibbenhorst, and J. van Turnhout, Adv. Mater., 14, 1041 (2002).
23. H.J. Cha, J. Hedrick, R.A. DiPietro, T. Blume, R. Beyers, and D.Y. Yoon, Appl. Phys. Lett., 68, 1930 (1996).
24. T. Liang, Y. Makita, and S. Kimura, Polymer, 42, 4867 (2001).
25. S.M. Hong and S.S. Hwang, J. Appl. Polym. Sci., 100, 4964 (2006).
26. H.J. Chu, B.K. Zhu, and Y.Y. Xu, J. Appl. Polym. Sci., 102, 1734 (2006).
27. L. Essen and K.D. Froome, Nature, 167, 512 (1951).
28. S.E. Gustafsson, in "Proceedings of Eighth Symposium Thermophysical Properties," J.V. Sengers, Eds., The American Society of Mechanical Engineers, New York, (1982), VII/110 ff.
29. E. Placido, M.C. Arduini-Schuster, and J. Kuhn, Infrared Phys. Technol., 46, 219 (2005).
30. O.A. Almanza, M.A. Rodriguez-Perez, and J.A. De Saja, J. Polym. Sci. B: Polym. Phys., 38, 993 (2000).
31. A. Prociak, J. Pielichowski, and T. Sterzynski, Polym. Test, 19, 705 (2000).
32. S.T. Lee, N.S. Ramesh, and G.A. Campbell, Polym. Eng. Sci., 36, 2477 (1996).
33. J. Shen, X. Cao, and L.J. Lee, Polymer, 47, 6303 (2006).
34. W.J. Seo, Y.T. Sung, S.B. Kim, Y.B. Lee, K.H. Choe, S.H. Choe, J.Y. Sung, and W.N. Kim, J. Appl. Polym. Sci., 102, 3764 (2006).
35. J. Shen, X. Han, and L.J. Lee, J. Cell. Plast., 42, 105 (2006).
36. J.B. Irving, D.T. Jamieson, and D.S. Paget, Trans. Inst. Chem. Eng., 51, 10 (1972).