Development and implementation of PWQ on patterned wafer darkfield inspection systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7272, Issue , 2009, Pages

  Streller, Uwe ^a   Wendt, Kay ^a   Wehner, Arno ^a   Goeckeritz, Jens ^a   Gahr, Markus ^b   Tuckermannb, Martin ^b   Kopp, Jennifer ^b   Hellerqvist, Monica ^b  

^a QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

ADI; Darkfield inspection; Defectivity; Lithography; Process monitoring; PWQ

Indexed keywords

ADI; ADVANCED DESIGNS; AUTOMATED SETUP; BRIGHTFIELD; DARK-FIELD; DARKFIELD INSPECTION; DEFECTIVITY; EASE-OF-USE; INSPECTION SYSTEM; LITHOGRAPHY PROCESS WINDOW; NEW APPROACHES; NOISE SUPPRESSION; NOVEL TECHNIQUES; PATTERNED WAFERS; PERFORMANCE REQUIREMENTS; PROCESS WINDOW; PWQ; WAFER INSPECTION;

DESIGN; INSPECTION; LITHOGRAPHY; PROCESS MONITORING; WINDOWS;

PROCESS CONTROL;

EID: 66649099607     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814149     Document Type: Conference Paper

References (5)

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3. Koblenz, T., et al., "PWQ Methodology for 300mm Production Environment," Yield Management Seminar (2005).
4. Brodsky, M., et al., "Improved Time to Results using SEM-Based PWQ Application for Advanced Semiconductor Devices," Yield Management Seminar, Japan (2006).
5. Perry-Sullivan, C., et al., "Advanced Darkfield Inspection for 65nm Design Rules and Below," Yield Management Solutions (2006).