Copper dissolution in ammonia solutions: Identification of the mechanism at low overpotentials

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Strmčnik, Dušan ^a   Gaberšček, Miran ^a   Pihlar, Boris ^b   Kočar, Drago ^b   Jamnik, Janko ^a  

^a NATIONAL INSTITUTE OF CHEMISTRY   (Slovenia)

^b UNIVERSITY OF LJUBLJANA   (Slovenia)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORBED INTERMEDIATES; AMMONIA SOLUTION; CHEMICAL NATURE; CONCENTRATION OF; COPPER DISSOLUTION; CORROSION PRODUCTS; DISSOLUTION REACTIONS; ELECTROCHEMICAL METHODS; EXPERIMENTAL CONDITIONS; IMPEDANCE ANALYSIS; OPTICAL METHODS; OVER POTENTIAL; PASSIVE FILMS; POTENTIAL WINDOWS; PRESENCE/ABSENCE; REACTION ORDERS; UNDERLYING MECHANISM;

AMMONIA; CONCENTRATION (PROCESS); COPPER; COPPER CORROSION; DISSOLVED OXYGEN; MEAN SQUARE ERROR; OPTICAL MICROSCOPY; PASSIVATION; SCANNING ELECTRON MICROSCOPY; STRAIN ENERGY;

DISSOLUTION;

EID: 65949112480     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3123289     Document Type: Article

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