Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

Corrosion

Volumn 53, Issue 5, 1997, Pages 389-398

  Feng, Y ^a,b   Siow, K S ^b   Teo, W K ^a   Tan, K L ^a   Hsieh, A K ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE POLYTECHNIC   (Singapore)

Author keywords

Anodic dissolution; Aqueous solutions; Copper; Corrosion behavior; Corrosion resistance; Diffusion; Morphology; Ph; Scanning electron microscopy; Tap water; X ray photoelectron spectroscopy

Indexed keywords

EID: 0000710821     PISSN: 00109312     EISSN: None     Source Type: Journal    
DOI: 10.5006/1.3280482     Document Type: Article

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