Microstructural evolution during deformation of tin dioxide nanoparticles in a comminution process

Acta Materialia

Volumn 57, Issue 10, 2009, Pages 3060-3071

  Armstrong, P ^a   Knieke, C ^a   Mackovic, M ^a   Frank, G ^a   Hartmaier, A ^a   Goken M ^a   Peukert, W ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

Molecular dynamics simulations; Nanomechanics; Nanostructure; Shear bands; Transmission electron microscopy (TEM)

Indexed keywords

CERAMIC NANOPARTICLES; COMMINUTION PROCESS; ELECTROSTATIC STABILIZATIONS; EVOLUTION OF THE MICROSTRUCTURES; FRACTURE MECHANISMS; FRACTURE PATTERNS; GRINDING BEHAVIORS; GRINDING PROCESS; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPIES; HRTEM ANALYSIS; INTERNAL MICROSTRUCTURES; MEAN PARTICLE SIZES; MICRO-STRUCTURAL; MICROSTRUCTURAL EFFECTS; MOLECULAR DYNAMICS SIMULATIONS; MULTIPLE PARTICLES; NANO-SCALE; REAL SAMPLES; RIETVELD REFINEMENT METHODS; STIRRED MEDIA MILLS; TIN DIOXIDE NANOPARTICLES; UNI-AXIAL COMPRESSIONS; WET GRINDING; X- RAY DIFFRACTIONS;

AGGLOMERATION; BRITTLE FRACTURE; DYNAMICS; ELECTRON MICROSCOPES; ELECTRON MICROSCOPY; GRINDING (COMMINUTION); GRINDING (MACHINING); GRINDING MILLS; LIGHT; MICROSTRUCTURE; MOLECULAR DYNAMICS; NANOMECHANICS; NANOPARTICLES; PLASTIC DEFORMATION; RIETVELD METHOD; RIETVELD REFINEMENT; SHEAR BANDS; STABILIZATION; STACKING FAULTS; TIN; TIN DIOXIDE; TITANIUM COMPOUNDS;

HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;

EID: 65349183529     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.02.049     Document Type: Article

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