Properties of nanocrystalline copper prepared by vacuum-warm-compaction method

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 19, Issue 2, 2009, Pages 394-398

  CHU, Guang ^a,b   LIU, Wei ^a   YANG, Tian zu ^a   TANG, Yong jian ^b  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b RESEARCH CENTER OF LASER FUSION   (China)

Author keywords

electrical resistivity; microhardness; nanomaterials; vacuum warm compaction

Indexed keywords

AVERAGE GRAIN SIZES; COARSE-GRAINED; ELECTRICAL RESISTIVITY; ELECTRONIC MICROSCOPES; HIGHER TEMPERATURES; MICROHARDNESS TESTERS; NANOCRYSTALLINE COPPERS; NANOCRYSTALLINE CU; NANOMATERIALS; X-RAY DIFFRACTOMETERS;

COMPACTION; COPPER; ELECTRIC RESISTANCE; MICROHARDNESS; NANOSTRUCTURED MATERIALS; VACUUM;

NANOCRYSTALLINE MATERIALS;

EID: 64149123019     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(08)60284-8     Document Type: Article

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