Thermal performance evaluation and optimization for redistributed chip package (RCP) designs

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages

  Chiriac, Victor ^a   Keser, Beth ^a   Duong, Trung ^a   Larsen, Larry ^a   Ramanathan, Lakshmi N ^a  

^a FREESCALE SEMICONDUCTOR   (United States)

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EID: 84877259208     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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