Microstructure and electromagnetic properties of Al18B4O33w/Co composite particles prepared by electroless plating method

Surface and Coatings Technology

Volumn 203, Issue 16, 2009, Pages 2221-2228

  Jiang, J T ^a   Zhen, L ^a   Yang, L ^a   Shao, W Z ^a   Xu, C Y ^a   Chao, Z M ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Beijing Institute of Environmental Features   (China)

Author keywords

Al18B4O33w Co composite particles; Electroless plating; Electromagnetic properties; Microstructure; Process parameters

Indexed keywords

ACTIVATED SURFACES; AL18B4O33W/CO COMPOSITE PARTICLES; BATH TEMPERATURES; CRYSTALLINITY; ELECTROMAGNETIC PROPERTIES; GROWTH BEHAVIORS; MASS-GAINS; MICROWAVE BANDS; PROCESS PARAMETERS;

CAPILLARITY; COMPOSITE MATERIALS; ELECTROLESS PLATING; ELECTROMAGNETISM; MICROSTRUCTURE; PH EFFECTS; PHOSPHORUS; REACTION RATES; THERMAL EFFECTS;

ALUMINUM;

EID: 63749131576     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.02.009     Document Type: Article

References (26)

1. Smith J., and Win H.P.J. Ferrites, Phillips Technical Library, Eindhoven (1959)
2. Rousselle D., Berthault A., Acher O., Bouchaud J.P., and Zerah P.G. J. Appl. Phys. 74 (1993) 475
3. Iakubov T., Lagarkov A.N., Marklakov S.A., Osipov A.V., Rozanov K.N., Ryzhikov I.A., Simonov N.A., and Starostenko S.N. J. Magn. Magn. Mater. 258-259 (2004) 195
4. Acher O., Vermeulen J.L., Jacquart P.M., Fontaine J.M., and Baclet P. J. Magn. Magn. Mater. 136 (1994) 269
5. Chen R.C., Peng L.M., Duan X.F., Chen Q., and Liang X.L. Adv. Mater. 16 (2004) 401
6. Wen L.S., Huang R.F., Liu D.C., Hu X.T., Bai X.D., Sun C., and Gong J. Surf. Coat. Technol. 130 (2000) 100
7. Shen X., Gong R.Z., Nie Y., and Nie J.H. J. Magn. Magn. Mater. 288 (2005) 397
8. Xie G.W., Wang Z.B., Cui Z.L., and Shi Y.L. Carbon 43 (2005) 3181
9. Jiang J.T., Zhen L., Xu C.Y., and Shao W.Z. Surf. Coat. Technol. 201 (2007) 6059
10. Rudnik E., Kokoszka K., and Lapsa J. Surf. Coat. Technol. 202 (2008) 2584
11. Khan M.R., and lee J.L. J. Appl. Phys. 57 (1985) 4028
12. Souleimanova R.S., Mukasyan A.S., and Varma A. Chem. Eng. Sci. 54 (1999) 3369
13. Liu W.L., Hsieh S.H., Tsai T.K., and Chen W.J. J. Electrochem. Soc. 151 (2004) C680
14. Matsubara H., Yonekawa T., Ishino Y., Nishiyama H., Saito N., and Inoue Y. Electrochim. Acta 47 (2002) 4011
15. Matsubara H., Yonekawa T., Ishino Y., Saito N., Nishiyama H., and Inoue Y. Electrochim. Acta 52 (2006) 402
16. Zhang C., Ling G.P., and He J.H. Mater. Lett. 58 (2004) 200
17. Jiang J.T., Zhen L., Xu C.Y., and Wu X.L. Surf. Coat. Technol. 201 (2006) 3139
18. Tarozaite R., Kurtinaitiene M., Dziuve A., and Jusys Z. Surf. Coat. Technol. 115 (1999) 57
19. Farr J.P.G., and Noshani A.A. Trans. IMF 74 (1996) 221
20. Kim T.H., Dulal S.M.S.I., Park C.H., Chae H., and Kim C.K. Surf. Coat. Technol. 202 (2008) 4861
21. Chekanova L.A., Denisova E.A., and Iskhakov R.S. IEEE Trans. Magn. 33 (1997) 3730
22. Liang M.W., Yen H.T., and Hsieh T.E. J. Electron. Mater. 35 (2006) 1593
23. Riedel W. Electroless Nickel Plating (1991), Finishing Publications Ltd., Stevenage
24. Kim S.S., Kim S.T., Ahn J.M., and Kim K.H. J. Magn. Magn. Mater. 271 (2004) 39
25. Iakubov I.T., Lagarkov A.N., Marklakov S.A., Osipov A.V., Rozanov K.N., Ryzhikov I.A., and Starostenko S.N. J. Magn. Magn. Mater. 272-276 (2004) 2208
26. Lagarkov A.N., and Sarychev A.K. Phys. Rev. B 53 (1996) 6318