Photo-polymerization property of the photosensitive core-shell structured microcapsule material

Journal of Photopolymer Science and Technology

Volumn 21, Issue 6, 2008, Pages 761-765

  Lai, Weidong ^a   Li, Xiaowei ^a   Feng, Hongguang ^a   Fu, Guangsheng ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

Interfacial polymerisation; Microcapsule; Photopolymer

Indexed keywords

EID: 63649147315     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.21.761     Document Type: Article

References (10)

1. Mitsuhito Suwa,Youji Fujita,Tomoyuki Yuba, et. al, J Photopolym. Sc.i Technol., 16 (2003), 221.
2. Kaczmarek Hahna, Öldak Dagmara, Szalla, et al, J. Appl. Polym. Sci., 14 (2002),3725.
3. Douglas J. Guerrero, Ramil Mercado, et. al, J. Photopolym. Sci. Technol., 19(2006), 343.
4. KyoungMo Jeong, Kenichi Koseki, J. Photopolym. Sci. Technol., 18(2005),691.
5. Kimiko Makino, Mebae Umetsu,Yuko Goto et.al., Colloid Surface B, 13 (1999),287.
6. Weidong Lai, Xiaowei Li, Nan zhang, et al, Proceedings ofSPIE, 2007, 64234E.
7. R. C. Liang, T. Chen, X. Phan, et al., U.S. Patent No. 2002155372 (2002).
8. K Kubo, T Kobayashi, S Nagae, et. al., Japan Patent No.2000296675-A (2000).
9. Z. H. Lu, T. Shutava, N. Sahiner, et. al., Chem. Lett., 34(2005), 1536.
10. T.Y. Lee, T. M. Roper, E. S. Jonsson, et. al., Polymer., 44(2003), 2859.