Effect of NaCl concentration in electrodeposited Co-P alloy thin films

Applied Surface Science

Volumn 255, Issue 13-14, 2009, Pages 6540-6544

  Kim, John H ^a   Raja, M ^b   Thanikaikarasan, S ^b   Kim, Yong Deak ^a   Srikumar, S R ^c   Mahalingam, T ^b  

^a Ajou University   (South Korea)

^b ALAGAPPA UNIVERSITY   (India)

^c KALASALINGAM UNIVERSITY   (India)

Author keywords

Co P alloy thin films; Coercivity; Electrodeposition; Scanning electron microscopy; Vibrating sample magnetometer; X ray diffraction

Indexed keywords

AMORPHOUS FILMS; COERCIVE FORCE; CYCLIC VOLTAMMETRY; ELECTRODEPOSITION; ELECTRODES; ENERGY DISPERSIVE X RAY ANALYSIS; MAGNETOMETERS; REMANENCE; SATURATION MAGNETIZATION; SCANNING ELECTRON MICROSCOPY; SODIUM ALLOYS; SODIUM CHLORIDE; THIN FILMS; X RAY DIFFRACTION;

CHLORIDE CONCENTRATIONS; CO-P ALLOY; COMPOSITIONAL ANALYSIS; ELECTRODEPOSITION TECHNIQUE; HEXAGONAL CLOSED PACKED (HCP) STRUCTURE; MECHANISM OF FORMATION; VIBRATING SAMPLE MAGNETOMETER; X-RAY DIFFRACTION STUDIES;

COBALT ALLOYS;

EID: 63449097540     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.02.037     Document Type: Article

References (27)

1. Homma T., Kita Y., and Osaka T. J. Electrochem. Soc. 147 1 (2000) 160
2. Chen T., Rogowski D.A., and White R.M. J. Appl. Phys. 49 (1978) 1816
3. Chin T.S. J. Magn. Magn. Mater. 209 (2000) 75
4. Judy J.W., and Muller R.S. IEEE. Microelectromech. Syst. 6 3 (1997) 249
5. Lee L.L., Laughlin D.E., and Lambeth D.N. IEEE. Trans. Magn. 34 (1998) 1561
6. Sinnecker J., Knobel M., Pirota K.R., Garcia J.M., Asenjo A., and Vazquez M. J. Appl. Phys. 87 (2000) 4825
7. DeMattei R.C., Watcharapasorn A., and Feigelson R.S. J. Electrochem. Soc. 148 (2001) D109
8. Ruythooren W., Beyne E., Celis J.P., and De Boeck J. IEEE Trans. Magn. 38 (2002) 3498
9. da silva R.C., Sartorelli M.L., Sartorelli M.S., Sardela M., and Pasa A.A. Phys. Stat. Sol. (a) 187 1 (2001) 85
10. S. Thanikaikarasan, T. Mahalingam, K. Sundaram, A. Kathalingam, Y.D. Kim, Vacuum (2009) (in press).
11. Lew K.S., Raja M., Thanikaikarasan S., Kim T., Kim Y.D., and Mahalingam T. Mater. Chem. Phys. 112 (2008) 249
12. da Silva R.C., dos Santos E.M., Sartorelli M.L., Sinnecker J.P., Gundel A., Sommer R.L., and Pasa A.A. J. Magn. Magn. Mater. 272-276 (2004) 1460
13. Perez L., De Abril O., Sanchez M.C., Arouca C., Lopez E., and Sanchez P. J. Magn. Magn. Mater. 196-197 (1999) 246
14. Jurado R.M., Gonzalez J.A., and Riveiro J.M. J. Magn. Magn. Mater. 215-216 (2000) 337
15. Depew J.R. J. Electrochem. Soc. 120 (1973) 1187
16. Aspland M., Jones G.A., and Middleton B.K. IEEE. Trans. Magn. Mag. 5 3 (1969) 314
17. Li L., Zhang Y., Deng S., and Chen Y. Mater. Lett. 57 (2003) 3444
18. Lee K.H., Kim G.H., and Jeung W.Y. Electrochem. Commun. 4 (2002) 605
19. Itakura K., Homma T., and Osaka T. Electrochim. Acta 44 (1999) 3707
20. Dini J.W. Plat. Surf. Finish 75 (1988) 642
21. Morikawa T., Nakade T., Yokoi M., Fukumoto Y., and Iwakura C. Electrochim. Acta 42 (1997) 115
22. Fukunaka Y., Aikawa S., and Asaki Z. J. Electrochem. Soc. 141 (1994) 1783
23. Brenner A. Electrodeposition of Alloys vol. I (1963), Academic Press, New York
24. Djokic S.S. J. Electrochem. Soc. 146 5 (1999) 1824
25. Jurado R.M., Gonazalez J.A., and Riveiro J.M. J. Magn. Magn. Mater. 196-197 (1999) 246
26. Lewis D.B., and Marshall G.W. Surf. Coat. Technol. 78 (1996) 150
27. Miksic H.G., Travieso R., Arcus A., and Wright R.H. J. Electrochem. Soc. 113 4 (1966) 360