Stress measurement in MEMS devices

2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001

Volumn , Issue , 2001, Pages 398-401

  Starman Jr , L ^a   Busbee, J ^b   Reber, J ^b   Lott, J ^a   Cowan, W ^b   Vandelli, N ^c  

^a AIR FORCE INSTITUTE OF TECHNOLOGY   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

^c Microcosm Technologies Inc   (United States)

Author keywords

MEMS; MUMPs; Raman Spectroscopy; Residual Stress; Young's Modulus

Indexed keywords

MEMS; MUMPS; PIN GRID ARRAYS (PGA);

COMPUTER AIDED DESIGN; COMPUTER SOFTWARE; DEPOSITION; ELASTIC MODULI; FINITE ELEMENT METHOD; POLYSILICON; RAMAN SPECTROSCOPY; RESIDUAL STRESSES; STRESS ANALYSIS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

MICROELECTROMECHANICAL DEVICES;

EID: 6344226892     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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