Modelling of microspring thermal actuator

2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004

Volumn 1, Issue , 2004, Pages 355-358

  Luo, J K ^a   Flewitt, A J ^a   Spearing, S M ^b   Fleck, N A ^a   Milne, W I ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Chevron; Electrothermal actuator; Metal MEMS; Microspring actuator

Indexed keywords

BUCKLING; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; ELECTRIC INSULATORS; ELECTRIC RESISTANCE; ELECTROPLATING; FINITE ELEMENT METHOD; OPTIMIZATION; SILICA; STRESS ANALYSIS; THERMAL EFFECTS;

CHEVRON; ELECTROTHERMAL ACTUATOR; METAL MEMS; MICROSPRING ACTUATOR;

ACTUATORS;

EID: 6344223346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. L.Que, J.S.Park and Y.B.Gianchandani; J.Microelectro. mech.sys. 10, 247 (01')
3. J.R.Reid, V.M.Bright and J.H.Comtois Proc. of SPIE 96 2882, 296 (1996).
4. R.Hichey, D.Sameoto, T.Hubbard amd M.Kujath; J. Micromech. MicroEng. 13, 40 (2003).
5. J.K. Luo, J.H.He, A.J.Flewitt, S.M.Spearing, N.A.Fleck and W.I.Milne; Proc. of SPIE 04 Conf. In press.
6. W.N.Jr.Sharpe, "Mechanical Properties of MEMS Materials" 2001, Johns Hopkins University: Baltimore, MD USA