Kinetic Monte Carlo simulation of thin film growth with void formation - Application to via filling

2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002

Volumn , Issue , 2002, Pages 430-433

  Hiwatari, Y ^a   Kaneko, Y ^b   Ohara, K ^c   Murakami, T ^c  

^a KANAZAWA UNIVERSITY   (Japan)

^b KYOTO UNIVERSITY   (Japan)

^c Central Research Laboratory   (Japan)

Author keywords

Monte Carlo simulation; Thin film; Via filling; Voids

Indexed keywords

ADSORPTION; COMPUTER SIMULATION; COPPER; ELECTROPLATING; FILM GROWTH; MONTE CARLO METHODS; SURFACES;

SOLID-BY-SOLID MODEL; V-SHAPED GROOVES; VIA FILLING; VOIDS;

THIN FILMS;

EID: 6344220196     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami, "Monte Carlo Simulation of Thin Film Growth with Lattice Defects", J. Phys. Soc. Japan, 60 3607 (2000).
2. Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami, "Surface Structure and Void Formation in Thin Film Growth: A Monte Carlo Simulation", Prog. Theor. Phy. Suppl., No.138, 126 (2000).
3. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans and H. Deligianni, "Damascene copper electroplating for chip interconnections", IBM J. Res. Develop. 42, 567 (1998) 567-574.
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7. Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami, "Computer Simulation of Thin Film Growth with Defect Formation", submitted to Surface and Coating Technology.