Analysis of thermal performance of high power light emitting diodes package

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 533-538

  Chi, Wei Hao ^a   Chou, Tsung Lin ^a   Han, Cheng Nan ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Conversion efficiency; Finite element analysis; Forward voltage method; High power LED package

Indexed keywords

CONVECTION COEFFICIENTS; COPPER SLUGS; DESIGN FACTORS; DESIGN PARAMETERS; DIE-ATTACH MATERIALS; DOMINANT FACTORS; ELECTRO-OPTICAL; EXPERIMENTAL DATUM; FACTORIAL DESIGNS; FEM MODELS; FINITE ELEMENT ANALYSIS; FINITE ELEMENT ANALYSIS PROGRAMS; FINITE ELEMENT MODELS; FORWARD VOLTAGE METHOD; HIGH POWER LED PACKAGE; HIGH-POWER LIGHT-EMITTING DIODES; INPUT POWER; JUNCTION TEMPERATURES; LIFE SPANS; MANUFACTURING PROCESS; SIMULATION ANALYSIS; SIMULATION RESULTS; THERMAL CHARACTERISTICS; THERMAL MANAGEMENTS; THERMAL PERFORMANCE;

CHIP SCALE PACKAGES; CONVERSION EFFICIENCY; DC GENERATORS; DESIGN; ELECTRONIC EQUIPMENT MANUFACTURE; GALLIUM NITRIDE; LIGHT EMITTING DIODES; SEMICONDUCTING GALLIUM;

FINITE ELEMENT METHOD;

EID: 63049112163     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763488     Document Type: Conference Paper

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