Characteristics of thermal resistance for high power LEDs

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 149-154

  Kuo, Sheng Liang ^a   Liu, Chun Kai ^a   Dai, Ming Ji ^a   Yu, Chih Kuang ^a   Chien, Heng Chieh ^a   Hsu, Chung Yen ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DC GENERATORS; ELECTRIC RESISTANCE; ELECTRONIC EQUIPMENT MANUFACTURE;

CONDUCTION TYPES; ELECTRICAL RESISTANCES; FAST MEASUREMENTS; HIGH-POWER LEDS; INPUT POWER; JUNCTION TEMPERATURES; LIGHT-OUTPUT EFFICIENCIES; MEASUREMENT SYSTEMS; MULTI CHIPS; SINGLE CHIPS; TEMPERATURE SENSITIVITIES; THERMAL CHARACTERISTICS; THERMAL PERFORMANCE; THERMAL RESISTANCES;

THERMAL EFFECTS;

EID: 63049097001     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763426     Document Type: Conference Paper

References (8)

1. S. Chhajed, Y. Xi, Th. Gessmann, and E.F. Schubert, "Junction Temperature in Light-emitting Diodes Assessed by Different Methods", Proc. SPIE, (2005).
2. Yangang XI, Thomas Gessmann, E. Fred Schubert, "Junction Temperature in Ultraviolet Light-Emitting Diodes", Japanese Journal of Applied Physics, Vol. 44, No. 10, (2005), pp. 7260-7266.
3. Lan Kim, Moo Whan Shin, "Thermal Resistance Measurement of LED Package with Multichips", IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, (2007), pp. 632-636.
4. http://www.philipslumileds.com/
5. Lianqiao Yang, Jianzheng Hu, Lan Kim, and MooWhan Shin, "Viriation of Thermal Resistance with Input Power in LEDs", Phys. Stat. Sol. (C)3, No. 6, (2006), pp. 2187-2196.
6. E. Fred SCHUBERT: Light-Emitting Diodes
7. Jayasinghe, L., Y. Gu, and N. Narendran, "Characterization of Thermal Resistance Coefficient of High-power LEDs", International Conference on Solid State Lighting, (2006).
8. Hyunsoo Kim, Seong-Ju Park, and Hyunsang