Low-temperature bonding of poly-(methyl methacrylate) microfluidic devices under an ultrasonic field

Journal of Micromechanics and Microengineering

Volumn 19, Issue 1, 2009, Pages

  Li, S W ^a   Xu, J H ^a   Wang, Y J ^a   Lu, Y C ^a   Luo, G S ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); CONTACT ANGLE; ESTERS; FLUIDIC DEVICES; PORTABLE EQUIPMENT; SUBSTRATES; SURFACE PROPERTIES; ULTRASONICS;

BOND STRENGTHS; BONDING METHODS; BONDING TEMPERATURES; LOW TEMPERATURES; LOW-TEMPERATURE BONDINGS; METHYL METHACRYLATES; MICRO-CHANNEL DEVICES; MICRO-DEVICES; MICRO-FLUIDIC DEVICES; SHAPE DISTORTIONS; STATIC WATERS; SUBSTRATE SURFACES; TYPICAL VALUES; ULTRASONIC ENERGIES; ULTRASONIC FIELDS;

BONDING;

EID: 62649168755     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/1/015035     Document Type: Article

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