Wafer Plane Inspection Evaluated for Photomask Production

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7122, Issue , 2008, Pages

  Gallagher, Emily ^a   Badger, Karen ^a   Lawliss, Mark ^a   Kodera, Yutaka ^b   Azpiroz, Jaione Tirapu ^a   Pang, Song ^c   Zhang, Hongqin ^c   Eugenieva, Eugenia ^c   Clifford, Chris ^c   Goonesekera, Arosha ^c   Tian, Yibin ^c  

^a IBM   (United States)

^b Toppan Photomasks Inc   (United States)

^c KLA TENCOR CORPORATION   (United States)

Author keywords

AIMS; Lithography simulation; Photomask inspection; Wafer Plane Inspection; WPI

Indexed keywords

AIMS; ALTERNATIVE APPROACHES; DEFECT SENSITIVITIES; DEFECT SIZES; HIGH RESOLUTION INSPECTIONS; HIGH-NA; INFORMED DECISIONS; LITHOGRAPHY SIMULATION; MANUFACTURING METHODS; MASK FEATURES; MASK INSPECTIONS; ON WAFERS; PRINTING DEFECTS; THRESHOLD MODELS; WAFER PLANE INSPECTION; WPI;

DEFECTS; PHOTOMASKS; PRINTING;

INSPECTION;

EID: 62649120887     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.801945     Document Type: Conference Paper

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