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Volumn 109, Issue 5, 2009, Pages 660-666
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Reactive diffusion under Laplace tension
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Author keywords
Al Cu; Atom probe tomography; Nanospheres; Nernst Planck coefficient; Reactive interdiffusion
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Indexed keywords
AL/CU;
ATOM PROBE TOMOGRAPHY;
ATOMIC TRANSPORTS;
CURVATURE RADIUS;
DEPOSITION SEQUENCES;
INTERFACIAL TENSIONS;
LAYER STRUCTURES;
LIMITING CASE;
NERNST-PLANCK COEFFICIENT;
REACTIVE DIFFUSIONS;
REACTIVE INTERDIFFUSION;
STACKING SEQUENCES;
SURFACES AND INTERFACES;
THERMAL REACTIONS;
THIN-FILM;
TUNGSTEN TIPS;
ATOMS;
DIAGNOSTIC RADIOGRAPHY;
ELECTRIC WIRE;
PROBES;
REACTION RATES;
TOMOGRAPHY;
TUNGSTEN;
NANOSPHERES;
ALUMINUM;
COPPER;
NANOSPHERE;
TUNGSTEN;
ARTICLE;
ATOM PROBE TOMOGRAPHY;
CHEMICAL REACTION KINETICS;
ELECTRON MICROSCOPY;
FILM;
TOMOGRAPHY;
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EID: 62549164266
PISSN: 03043991
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ultramic.2008.12.001 Document Type: Article |
Times cited : (3)
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References (17)
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