Metrology characterization for self aligned double patterning

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6922, Issue , 2008, Pages

  Berger, Ami ^a   Latinsky, Sergey ^a   Bar Zvi, Maayan ^a   Peltinov, Ram ^a   Shu, Jen ^b   Ngai, Chris ^b   Yu, James ^b   Dai, Huixiong ^b  

^a Applied Materials Inc Israel   (Israel)

^b APPLIED MATERIALS INC   (United States)

Author keywords

Line edge roughness (LER); Line width roughness (LWR); Roughness analysis; Self aligned double patterning (SADP)

Indexed keywords

ADVANCED TECHNOLOGY; DOUBLE PATTERNING; LINE EDGE ROUGHNESS; LINEWIDTH ROUGHNESS; MEASUREMENT METHODS; METROLOGY METHODS; ROUGHNESS ANALYSIS; SELF-ALIGNED; SEM IMAGING; SEMICONDUCTOR TECHNOLOGY; SEQUENTIAL PROCESS; SMALL FEATURES;

LITHOGRAPHY; MEASUREMENTS; PROCESS CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; UNITS OF MEASUREMENT;

ROUGHNESS MEASUREMENT;

EID: 62449176688     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.774408     Document Type: Conference Paper

References (2)

1. J.Villarubia, B.Bunday, Unbiased Estimation of Linewidth Roughness, SPIE Microlithography Conference 2005, Proc. SPIE 5752, p.61524L-1 (2005).
2. R.Katz, D.Chase, R.Kris, R.Peltinov, J.Villarubia, B.Bunday, Bias reduction in roughness measurement through SEM noise removal, SPIE Microlithography Conference 2006, Proc. SPIE 6152, p.61524L-1 (2006).