Bias reduction in roughness measurement through SEM noise removal

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6152 II, Issue , 2006, Pages

  Katz, R ^a   Chase, C D ^a   Kris, R ^a   Peltinov, ^a   Villarrubia, J ^b   Bunday, B ^c  

^a Applied Materials Inc Israel   (Israel)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c SEMATECH   (United States)

Author keywords

Line edge roughness (LER); Linewidth roughness (LWR); Noise removal; Roughness Measurements; SEM Metrology; Unbiased Estimation

Indexed keywords

COMPUTER SIMULATION; IMAGING TECHNIQUES; NOISE ABATEMENT; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICES; STANDARDS;

LINE EDGE ROUGHNESS (LER); LINEWIDTH ROUGHNESS (LWR); NOISE REMOVAL; ROUGHNESS MEASUREMENTS; SEM METROLOGY; UNBIASED ESTIMATION;

ROUGHNESS MEASUREMENT;

EID: 33745612054     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.661135     Document Type: Conference Paper

References (3)

1. B. D. Bunday, M. Bishop, D. McCormack, J. S. Villarrubia, A. E. Vladar, R. Dixson, T. Vorburger, and N. G. Orji, "Determination of Optimal Parameters for CD-SEM Measurement of Line Edge Roughness," Proc. SPIE 5375, 515-533 (2004).
2. J. S. Villarrubia and B. D. Bunday "Unbiased Estimation of Linewidth Roughness" Proc. SPIE 5752 480- 488 (2005).
3. SEMATECH, the SEMATECH logo, AMRC, Advanced Materials Research Center, ATDF, the ATDF logo, Advanced Technology Development Facility, ISMI and International SEMATECH Manufacturing Initiative are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.