Through silicon vias as enablers for 3D systems

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2008, Pages 119-122

  Jung, Erik ^a   Ostmann, A ^a   Ramm, P ^a,b   Wolf, J ^a   Toepper, M ^a   Wiemer, M ^a,b  

^a FRAUNHOFER IZM   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3D SYSTEMS; ACTIVE CIRCUITS; COMPLEX SYSTEMS; FABRICATION PROCESS; THROUGH SILICON VIAS;

MICROELECTROMECHANICAL DEVICES;

MEMS;

EID: 62249210280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2008.4752965     Document Type: Conference Paper

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