Hot roller embossing for the creation of microfluidic devices

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2008, Pages 262-266

  Ng, S H ^a   Wang, Z F ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FLUIDIC DEVICES; MICROELECTROMECHANICAL DEVICES; PILES; ROLLERS (MACHINE COMPONENTS);

FEATURE SIZES; LATERAL DIMENSIONS; MICRO-FLUIDIC DEVICES; MICROFLUIDIC STRUCTURES; PILE-UP; POLYMER MATERIALS; POLYMER SHEETS;

MEMS;

EID: 62249126253     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2008.4752997     Document Type: Conference Paper

References (5)

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5. S.H. Ng, Z.F. Wang, R.T. Tjeung, and N.F. de Rooij, "Development of a multi-layer microelectrofluidic platform," Journal of Microsystem Technologies, vol. 13, pp. 1509, 2007.