Numerical simulation and experimental verification of a flat two-phase thermosyphon

Energy Conversion and Management

Volumn 50, Issue 4, 2009, Pages 1095-1100

  Zhang, Ming ^a   Liu, Zhongliang ^a   Ma, Guoyuan ^a   Cheng, Shuiyuan ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Electronics cooling; Numerical simulation; Two phase thermosyphon

Indexed keywords

CAPILLARY FLOW; COMPUTER SIMULATION; COOLING; HEAT SINKS; MASS TRANSFER; MATHEMATICAL MODELS;

ELECTRONICS COOLING; EXPERIMENTAL VERIFICATIONS; HEAT AND MASS TRANSFERS; HEAT SOURCES; HOT SPOTS; NUMERICAL RESULTS; NUMERICAL SIMULATION; THERMAL RESISTANCES; TWO-DIMENSIONAL; TWO-PHASE THERMOSYPHON; UNIFORM HEAT FLUXES; VAPOR VELOCITIES;

SIPHONS;

EID: 61649084676     PISSN: 01968904     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enconman.2008.12.001     Document Type: Article

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