Thermal residual stresses in single-sided bonded composite patching

Journal of Reinforced Plastics and Composites

Volumn 28, Issue 5, 2009, Pages 587-599

  Wang, Zun ^a   Xiao, Jiayu ^a   Jiang, Dazhi ^a   Zeng, Jingcheng ^a   Yang, Fubiao ^a  

^a NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY   (China)

Author keywords

Adhesively single sided bonding; Composite patch; Finite element analysis; Thermal residual stress strain

Indexed keywords

ALUMINA; RESIDUAL STRESSES; SHEAR STRESS; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS; SUBSTRATES; THERMAL EXPANSION;

ADHESIVE INTERFACES; ADHESIVE LAYERS; ADHESIVELY SINGLE-SIDED BONDING; ALUMINUM ALLOY SUBSTRATES; CARBON/EPOXY COMPOSITES; COEFFICIENTS OF THERMAL EXPANSIONS; COMPOSITE PATCH; EFFICIENT METHODS; FINITE ELEMENT ANALYSIS; FINITE ELEMENT MODELS; PATCHED STRUCTURES; STIFFNESS RATIOS; STRESS DECREASE; THERMAL RESIDUAL STRESS; THERMAL RESIDUAL STRESS/STRAIN; TWO-DIMENSIONAL PLANES;

FINITE ELEMENT METHOD;

EID: 61449137760     PISSN: 07316844     EISSN: 15307964     Source Type: Journal    
DOI: 10.1177/0731684407085416     Document Type: Article

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